Inventor · disambiguated record
Krishna Bharath
Also filed as: BHARATH KRISHNA
48 granted patents·17 pending applications·90 citations·filing 2010–2025
97Inventor score
Top patents by PatentIndex Score
65 records- 0197US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0294US9129817B2Magnetic core inductor (MCI) structures for integrated voltage regulatorsELSHERBINI ADEL A·Filed 2013·Granted Sep 8, 2015·24 cites·18 claims
- 0392US12288750B2Conformal power delivery structure for direct chip attach architecturesINTEL CORP·Filed 2021·Granted Apr 29, 2025·2 cites·25 claims
- 0492US9607947B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2016·Granted Mar 28, 2017·8 cites·9 claims
- 0591US11462463B2Microelectronic assemblies having an integrated voltage regulator chipletINTEL CORP·Filed 2018·Granted Oct 4, 2022·6 cites·12 claims
- 0691US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 0790US9041205B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2013·Granted May 26, 2015·10 cites·8 claims
- 0889US12406962B2Power delivery through capacitor-dies in a multi-layered microelectronic assemblyINTEL CORP·Filed 2021·Granted Sep 2, 2025·2 cites·20 claims
- 0989US12199018B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Jan 14, 2025·2 cites·20 claims
- 1089US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 1186US9753510B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2015·Granted Sep 5, 2017·5 cites·20 claims
- 1281US11450560B2Microelectronic assemblies having magnetic core inductorsINTEL CORP·Filed 2018·Granted Sep 20, 2022·3 cites·19 claims
- 1378US11189580B2Electrostatic discharge protection in integrated circuitsINTEL CORP·Filed 2019·Granted Nov 30, 2021·2 cites·19 claims
- 1477US11791528B2Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial lineINTEL CORP·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 1576US9391025B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2015·Granted Jul 12, 2016·2 cites·8 claims
- 1675US2024355768A1Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2024·Application pending·0 cites
- 1774US2024355725A1Power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1873US11955426B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·15 claims
- 1973US2025294781A1Magnetic core inductors on package substratesINTEL CORP·Filed 2025·Application pending·0 cites
- 2072US10186465B2Package-integrated microchannelsINTEL CORP·Filed 2015·Granted Jan 22, 2019·2 cites·25 claims
- 2171US11916006B2Microelectronic assemblies having an integrated voltage regulator chipletINTEL CORP·Filed 2022·Granted Feb 27, 2024·0 cites·7 claims
- 2271US11393751B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2018·Granted Jul 19, 2022·1 cites·15 claims
- 2371US11329358B2Low loss and low cross talk transmission lines having l-shaped cross sectionsINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·9 claims
- 2470US12336196B2Magnetic core inductors on package substratesINTEL CORP·Filed 2018·Granted Jun 17, 2025·1 cites·20 claims
- 2569US12002745B2High performance integrated RF passives using dual lithography processINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 2669US10503227B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2017·Granted Dec 10, 2019·1 cites·20 claims
- 2768US10971453B2Semiconductor packaging with high density interconnectsINTEL CORP·Filed 2016·Granted Apr 6, 2021·1 cites·20 claims
- 2866US11380652B2Multi-level distributed clampsINTEL CORP·Filed 2017·Granted Jul 5, 2022·1 cites·15 claims
- 2966US10410939B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2015·Granted Sep 10, 2019·1 cites·25 claims
- 3065US11881457B2Semiconductor packaging with high density interconnectsTAHOE RES LTD·Filed 2021·Granted Jan 23, 2024·0 cites·19 claims
- 3163US12154710B2Package embedded magnetic power transformers for SMPSINTEL CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 3262US12087682B2Power delivery structuresINTEL CORP·Filed 2020·Granted Sep 10, 2024·0 cites·25 claims
- 3360US11676950B2Via-in-via structure for high density package integrated inductorINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·23 claims
- 3460US8219377B2Multi-layer finite element method for modeling of package power and ground planesBHARATH KRISHNA·Filed 2010·Granted Jul 10, 2012·2 cites·15 claims
- 3560US2025067942A1Electrical-optical conversion with 3d stacked photonic chiplet(s) in substrateLIGHTMATTER INC·Filed 2024·Application pending·0 cites
- 3659US10971416B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 3758US12381029B2Stepped coax MIL PTHS for modulating inductance within a packageINTEL CORP·Filed 2020·Granted Aug 5, 2025·0 cites·19 claims
- 3857US2023089093A1In-built magnetic inductor schemes for glass core substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 3956US12242290B2Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architecturesINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 4056US12224252B2Magnetic core inductors in interposerINTEL CORP·Filed 2020·Granted Feb 11, 2025·0 cites·25 claims
- 4156US12068684B2Multi-phase switching regulators with hybrid inductors and per phase frequency controlINTEL CORP·Filed 2020·Granted Aug 20, 2024·0 cites·25 claims
- 4255US12308362B2Packaging architecture for disaggregated integrated voltage regulatorsINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 4352US12469820B2Fine-grained disaggregated server architectureINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 4452US11538617B2Integrated magnetic core inductors on glass core substratesINTEL CORP·Filed 2018·Granted Dec 27, 2022·0 cites·18 claims
- 4550US11735535B2Coaxial magnetic inductors with pre-fabricated ferrite coresINTEL CORP·Filed 2019·Granted Aug 22, 2023·0 cites·23 claims
- 4650US2023095608A1Conformal power delivery structures including embedded passive devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 4750US2023068300A1Packaging architecture for disaggregated integrated voltage regulatorsINTEL CORP·Filed 2021·Application pending·0 cites
- 4850US2023095654A1Conformal power delivery structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 4949US11404364B2Multi-layer embedded magnetic inductor coilINTEL CORP·Filed 2018·Granted Aug 2, 2022·0 cites·12 claims
- 5049US11227825B2High performance integrated RF passives using dual lithography processINTEL CORP·Filed 2015·Granted Jan 18, 2022·0 cites·9 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Krishna Bharath files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →