Inventor · disambiguated record
Kristof Darmawikarta
Also filed as: DARMAWIKARTA KRISTOF KUWAWI · Darmawikarta Kristof
102 granted patents·109 pending applications·107 citations·filing 2015–2025
99Inventor score
Top patents by PatentIndex Score
211 records- 0197US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0296US11393766B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2020·Granted Jul 19, 2022·3 cites·18 claims
- 0396US10727185B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2016·Granted Jul 28, 2020·11 cites·20 claims
- 0494US12014989B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jun 18, 2024·1 cites·20 claims
- 0594US11728258B2Electroless metal-defined thin pad first level interconnects for lithographically defined viasINTEL CORP·Filed 2021·Granted Aug 15, 2023·2 cites·6 claims
- 0694US10431537B1Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2018·Granted Oct 1, 2019·11 cites·26 claims
- 0793US11164818B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2019·Granted Nov 2, 2021·7 cites·19 claims
- 0893US11069620B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2017·Granted Jul 20, 2021·6 cites·25 claims
- 0991US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 1090US11309239B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 1189US2025323167A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 1288US2025125275A1Multi-chip package with high density interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1387US11101222B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2016·Granted Aug 24, 2021·4 cites·25 claims
- 1487US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 1586US10790233B2Package substrates with integral devicesINTEL CORP·Filed 2016·Granted Sep 29, 2020·5 cites·23 claims
- 1686US10714434B1Integrated magnetic inductors for embedded-multi-die interconnect bridge substratesINTEL CORP·Filed 2018·Granted Jul 14, 2020·4 cites·20 claims
- 1786US2025323166A1Lithographic cavity formation to enable emib bump pitch scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 1886US2024332203A1Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 1985US12300613B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 2085US10872872B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2016·Granted Dec 22, 2020·4 cites·17 claims
- 2185US2025125277A1Panel level packaging for multi-die products interconnected with very high density (vhd) interconnect layersINTEL CORP·Filed 2024·Application pending·0 cites
- 2284US11430740B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2017·Granted Aug 30, 2022·2 cites·13 claims
- 2384US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 2484US2025253245A1Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2025·Application pending·0 cites
- 2584US2025069902A1Integrated circuit package supportsINTEL CORP·Filed 2024·Application pending·0 cites
- 2684US2024258240A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 2783US12504581B2Photonic interconnect and components in glassINTEL CORP·Filed 2021·Granted Dec 23, 2025·1 cites·21 claims
- 2883US12354963B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·19 claims
- 2983US12334443B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jun 17, 2025·0 cites·18 claims
- 3083US12176223B2Integrated circuit package supportsINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 3183US11107781B2RFIC having coaxial interconnect and molded layerINTEL CORP·Filed 2017·Granted Aug 31, 2021·3 cites·20 claims
- 3282US11532584B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2020·Granted Dec 20, 2022·1 cites·18 claims
- 3382US11081768B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2019·Granted Aug 3, 2021·2 cites·21 claims
- 3481US12218071B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2023·Granted Feb 4, 2025·0 cites·28 claims
- 3581US11901296B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3680US12494443B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 3780US12218069B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 3880US11894311B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 3979US12300620B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4078US12046560B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2021·Granted Jul 23, 2024·0 cites·19 claims
- 4178US12040276B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 4278US11908802B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2022·Granted Feb 20, 2024·0 cites·19 claims
- 4378US11211345B2In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the sameINTEL CORP·Filed 2017·Granted Dec 28, 2021·2 cites·19 claims
- 4477US11804455B1Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·25 claims
- 4577US11257745B2Electroless metal-defined thin pad first level interconnects for lithographically defined viasINTEL CORP·Filed 2017·Granted Feb 22, 2022·2 cites·11 claims
- 4677US2025118647A1Nested interposer with through-silicon via bridge dieINTEL CORP·Filed 2024·Application pending·0 cites
- 4776US11854834B2Integrated circuit package supportsINTEL CORP·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 4876US11784128B2Die interconnect substrate, an electrical device and a method for forming a die interconnect substrateINTEL CORP·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 4976US11699648B2Electromigration resistant and profile consistent contact arraysTAHOE RES LTD·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 5075US11929330B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
Showing the top 50 of 211 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →