Inventor · disambiguated record
Kraig A. Quinn
Also filed as: QUINN KRAIG A
16 granted patents·569 citations·filing 1991–2005
95Inventor score
Files withXEROX CORP16
Top patents by PatentIndex Score
16 records- 0190US5528272AFull width array read or write bars having low induced thermal stressXEROX CORP·Filed 1993·Granted Jun 18, 1996·92 cites·11 claims
- 0288US5753959AReplacing semiconductor chips in a full-width chip arrayXEROX CORP·Filed 1997·Granted May 19, 1998·60 cites·7 claims
- 0381US5128282AProcess for separating image sensor dies and the like from a wafer that minimizes silicon wasteXEROX CORP·Filed 1991·Granted Jul 7, 1992·80 cites·5 claims
- 0479US5510273AProcess of mounting semiconductor chips in a full-width-array imageXEROX CORP·Filed 1995·Granted Apr 23, 1996·60 cites·5 claims
- 0578US5784258AWiring board for supporting an array of imaging chipsXEROX CORP·Filed 1997·Granted Jul 21, 1998·53 cites·14 claims
- 0675US6165813AReplacing semiconductor chips in a full-width chip arrayXEROX CORP·Filed 1995·Granted Dec 26, 2000·28 cites·4 claims
- 0772US5219796AMethod of fabricating image sensor dies and the like for use in assembling arraysXEROX CORP·Filed 1991·Granted Jun 15, 1993·53 cites·15 claims
- 0871US5473513APhotosensitive array wherein chips are not thermally matched to the substrateXEROX CORP·Filed 1994·Granted Dec 5, 1995·36 cites·19 claims
- 0970US5545913AAssembly for mounting semiconductor chips in a full-width-array image scannerXEROX CORP·Filed 1994·Granted Aug 13, 1996·40 cites·13 claims
- 1065US5668400ASemiconductor wafer divisible into chips for creating or recording imagesXEROX CORP·Filed 1996·Granted Sep 16, 1997·19 cites·5 claims
- 1158US5272113AMethod for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrateXEROX CORP·Filed 1992·Granted Dec 21, 1993·22 cites·5 claims
- 1255US5706176AButted chip array with beveled chipsXEROX CORP·Filed 1996·Granted Jan 6, 1998·15 cites·9 claims
- 1351US6752888B2Mounting and curing chips on a substrate so as to minimize gapXEROX CORP·Filed 2001·Granted Jun 22, 2004·4 cites·24 claims
- 1451US6747259B1Assembly of imaging arrays for large format documentsXEROX CORP·Filed 2000·Granted Jun 8, 2004·3 cites·11 claims
- 1544US7350712B2Image sensor module architectureXEROX CORP·Filed 2005·Granted Apr 1, 2008·0 cites·9 claims
- 1633US6252780B1Construction of scanning or imaging arrays suitable for large documentsXEROX CORP·Filed 1998·Granted Jun 26, 2001·4 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →