Inventor · disambiguated record
Krishna Vasanth Valavala
Also filed as: VALAVALA KRISHNA VASANTH
6 granted patents·10 pending applications·5 citations·filing 2018–2023
70Inventor score
Files withINTEL CORP16
Top patents by PatentIndex Score
16 records- 0184US12347780B2Integrated circuit package with flipped high bandwidth memory deviceINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
- 0275US11664293B2Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenariosINTEL CORP·Filed 2019·Granted May 30, 2023·2 cites·16 claims
- 0373US11694942B2Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal managementINTEL CORP·Filed 2018·Granted Jul 4, 2023·2 cites·15 claims
- 0457US2025194109A1Methods and architectures for hybrid solder and solderless die stackingINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2024063183A1Modular package architecture for voltage regulator-compute-memory circuits with quasi-monolithic chip layersINTEL CORP·Filed 2022·Application pending·0 cites
- 0652US2024063179A1Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 0751US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0850US2024061194A1Photonic quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 0950US2024063076A1Integrated conformal thermal heat spreader for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1050US2024063089A1Thermal management of base dies in multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1148US11756856B2Package architecture including thermoelectric cooler structuresINTEL CORP·Filed 2018·Granted Sep 12, 2023·0 cites·14 claims
- 1248US2023100576A1Thick and thin traces in a bridge with a glass coreINTEL CORP·Filed 2021·Application pending·0 cites
- 1347US11658095B2Bump integrated thermoelectric coolerINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·15 claims
- 1446US11462457B2Using a thermoelectric cooler to reduce heat transfer between heat-conducting platesINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·18 claims
- 1543US2023290706A1Vapor chamber integrated heat spreader (ihs) with liquid reservoirINTEL CORP·Filed 2022·Application pending·0 cites
- 1640US2020312741A1Thermoelectric cooler to enhance thermal-mechanical package performanceINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →