Inventor · disambiguated record
Krishna Hemanth Vepakomma
Also filed as: VEPAKOMMA KRISHNA HEMANTH
1 granted patent·3 pending applications·5 citations·filing 2015–2020
26Inventor score
Top patents by PatentIndex Score
4 records- 0185US9488857B2Method of strengthening an edge of a glass substrateCORNING INC·Filed 2015·Granted Nov 8, 2016·5 cites·20 claims
- 0235US2020118940A1Die with bumper for solder joint reliabilityINTEL CORP·Filed 2018·Application pending·0 cites
- 0332US2022093480A1Mold-in-mold structure to improve solder joint reliabilityINTEL CORP·Filed 2020·Application pending·0 cites
- 0432US2017197170A1Defect tolerant honeycomb structuresCORNING INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →