Inventor · disambiguated record
Kunihiko Akai
Also filed as: AKAI KUNIHIKO
8 granted patents·20 pending applications·4 citations·filing 2005–2025
76Inventor score
Top patents by PatentIndex Score
28 records- 0178US12246398B2Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Mar 11, 2025·1 cites·8 claims
- 0269US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 0365US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 0465US8480970B2Analytical pretreatment deviceKAWAZOE HIROSHI·Filed 2005·Granted Jul 9, 2013·2 cites·30 claims
- 0565US2024352287A1Curable adhesive composition, filmy adhesive, method for producing multilayered wiring board, and multilayered wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0662US2025205799A1Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpRESONAC CORP·Filed 2025·Application pending·0 cites
- 0760US8480971B2Analytical pretreatment deviceKAWAZOE HIROSHI·Filed 2011·Granted Jul 9, 2013·1 cites·31 claims
- 0856US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 0956US11287313B2Detecting compositions and method of using sameSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Mar 29, 2022·0 cites·16 claims
- 1053US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1153US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1252US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 1351US2011135817A1Microfluid-System-Supporting Unit And Production Method ThereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
- 1451US2011132535A1Microfluid-System-Supporting Unit And Production Method ThereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
- 1550US12100923B2Connection structure and manufacturing method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·6 claims
- 1650US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1750US2011140300A1Microfluid-System-Supporting Unit And Production Method ThereofHITACHI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
- 1850US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1949US2023397337A1Method for manufacturing substrate with built-in components, and substrate with built-in componentsSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2049US2010327237A1Conductive particle and method for producing conductive particleHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 2148US8383016B2Conductive fine particles and anisotropic conductive materialHITACHI CHEMICAL CO LTD·Filed 2012·Granted Feb 26, 2013·0 cites·12 claims
- 2248US2007183933A1Supporting unit for microfluid systemHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2347US2011044864A1Supporting unit for microfluid systemHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
- 2447US2023328897A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming memberSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2545US2009291264A1Microfluid-System-Supporting Unit And Production Method ThereofHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2643US2024105653A1Solder paste, method for forming solder bumps, and method for producing member with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 2743US2024297135A1Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 2834US2011031449A1Conductive fine particles and anisotropic conductive materialHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →