Inventor · disambiguated record
Kunliang Bu
Also filed as: BU KUNLIANG
0 granted patents·4 pending applications·0 citations·filing 2023–2024
Files withTENCENT TECH SHENZHEN CO LTD4
Top patents by PatentIndex Score
4 records- 0153US2023419148A1Quantum chip and method for preparing the sameTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 0249US2023197572A1Through-silicon-via structure and method for preparing same, through-silicon-via interconnection structure and method for preparing same, and electronic deviceTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 0347US2024423103A1Air bridge preparation method, quantum chip, and quantum computerTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 0447US2023422634A1Method and system for preparing josephson junctionTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kunliang Bu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →