Inventor · disambiguated record
Kuo Hsun Chen
Also filed as: CHEN KUO HSUN
9 granted patents·8 pending applications·26 citations·filing 2007–2023
82Inventor score
Top patents by PatentIndex Score
17 records- 0188US8652641B2Heat conductive dielectric polymer material and heat dissipation substrate containing the sameWANG DAVID SHAU CHEW·Filed 2011·Granted Feb 18, 2014·12 cites·13 claims
- 0279US9431822B1Over-current protection devicePOLYTRONICS TECHNOLOGY CORP·Filed 2015·Granted Aug 30, 2016·3 cites·14 claims
- 0373US8941462B2Over-current protection device and method of making the sameLEE WEN FENG·Filed 2013·Granted Jan 27, 2015·5 cites·26 claims
- 0464US9291311B2Illumination apparatusCHEN KUO HSUN·Filed 2013·Granted Mar 22, 2016·4 cites·17 claims
- 0559US7391295B2High voltage over-current protection devicePOLYTRONICS TECHNOLOGY CORP·Filed 2007·Granted Jun 24, 2008·2 cites·10 claims
- 0654US11044817B2Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2020·Granted Jun 22, 2021·0 cites·12 claims
- 0754US2023249438A1Metal clad substratePOLYTRONICS TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0850US2024227358A9Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0947US2008292857A1Heat dissipation substrate and heat dissipation material thereofPOLYTRONICS TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1047US2011217462A1Methods for manufacturing insulated heat conductive substrate and insulated heat conductive composite substratePOLYTRONICS TECHNOLOGY CORP·Filed 2011·Application pending·0 cites
- 1145US11778739B2Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Oct 3, 2023·0 cites·8 claims
- 1245US9074127B2Heat radiating materialJHUO YU SIAN·Filed 2013·Granted Jul 7, 2015·0 cites·9 claims
- 1345US2008057333A1Heat dissipation substrate for electronic devicePOLYTRONICS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1441US2017066955A1Thermal interface materialPOLYTRONICS TECHNOLOGY CORP·Filed 2016·Application pending·0 cites
- 1541US2013062045A1Heat-conductive dielectric polymer material and heat dissipation substrate containing the sameCHU FU HUA·Filed 2011·Application pending·0 cites
- 1637US9340712B2Adhesive materialCHEN KUO HSUN·Filed 2013·Granted May 17, 2016·0 cites·10 claims
- 1731US2019023960A1Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →