Inventor · disambiguated record
Kun-Ei Chen
Also filed as: CHEN KUN-EI
13 granted patents·5 pending applications·24 citations·filing 2002–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13TAIWAN SEMICONDUCTOR MFG2CHEN JEN-YI1CHEN KUN-EI1HSU CHUN-YUAN1
Top patents by PatentIndex Score
18 records- 0181US9722076B2Method for manufacturing semiconductor device with contamination improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·3 cites·18 claims
- 0280US8698217B2Metal shield structures in backside illumination image sensor chipsHSU CHUN-YUAN·Filed 2012·Granted Apr 15, 2014·4 cites·20 claims
- 0380US8586486B2Method for forming semiconductor deviceCHEN JEN-YI·Filed 2011·Granted Nov 19, 2013·6 cites·12 claims
- 0477US8034722B2Method of forming dual damascene semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 11, 2011·8 cites·13 claims
- 0574US2025294790A1Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0673US2024371919A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0773US2025349626A1Manufacturing method of semiconductor structure and semiconductor structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0871US2025285916A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0969US12080751B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1068US12342564B2Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1167US12341060B2Method for manufacturing through vias using amorphization to adjust etching rateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1264US12269135B2Work piece holder and method of transferring a work pieceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1363US12424499B2Manufacturing method of semiconductor structure and semiconductor structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 1460US11004973B2Semiconductor device with contamination improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 1558US8900886B2System and method of monitoring and controlling atomic layer deposition of tungstenCHEN KUN-EI·Filed 2012·Granted Dec 2, 2014·1 cites·18 claims
- 1658US2025226322A1Interconnect layer with different dielectric regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1755US10312366B2Semiconductor device with contamination improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·0 cites·20 claims
- 1841US6965432B2Non-invasive wafer transfer position diagnosis and calibrationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 15, 2005·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →