Inventor · disambiguated record
Kun-Ching Chen
Also filed as: CHEN KUN-CHING
20 granted patents·4 pending applications·817 citations·filing 1998–2009
95Inventor score
Top patents by PatentIndex Score
24 records- 0196US6680529B2Semiconductor build-up packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 20, 2004·154 cites·19 claims
- 0296US6528882B2Thermal enhanced ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·151 cites·18 claims
- 0395US6737300B2Chip scale package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 18, 2004·123 cites·22 claims
- 0492US6701614B2Method for making a build-up package of a semiconductorADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 9, 2004·89 cites·9 claims
- 0589US6191360B1Thermally enhanced BGA packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 20, 2001·109 cites·6 claims
- 0686US6534852B1Ball grid array semiconductor package with improved strength and electric performance and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 18, 2003·55 cites·10 claims
- 0785US6423622B1Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 23, 2002·40 cites·20 claims
- 0878US7125745B2Multi-chip package substrate for flip-chip and wire bondingADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·26 cites·4 claims
- 0975US6750397B2Thermally enhanced semiconductor build-up packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 15, 2004·23 cites·11 claims
- 1063US6455941B1Chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 24, 2002·13 cites·14 claims
- 1153US6551855B1Substrate strip and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Apr 22, 2003·5 cites·11 claims
- 1251US6642612B2Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Nov 4, 2003·4 cites·20 claims
- 1350US6714421B2Flip chip package substrateADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 30, 2004·3 cites·5 claims
- 1448US5982625ASemiconductor packaging deviceADVANCED SEMICONDUCTOR ENG·Filed 1998·Granted Nov 9, 1999·15 cites·20 claims
- 1544US8720053B2Process of fabricating a circuit boardLEE SHIH-CHANG·Filed 2009·Granted May 13, 2014·0 cites·12 claims
- 1639US7061347B2High frequency substrate comprised of dielectric layers of different dielectric coefficientsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·0 cites·9 claims
- 1737US7061084B2Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·0 cites·18 claims
- 1836US6313413B1Wire structure of substrate for layout detectionADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 6, 2001·7 cites·10 claims
- 1936US2004124955A1High frequency substrateFiled 2003·Application pending·0 cites
- 2035US2002189091A1Method of making printed circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
- 2135US2002098620A1Chip scale package and manufacturing method thereofFiled 2001·Application pending·0 cites
- 2234US2002081771A1Flip chip processFiled 2001·Application pending·0 cites
- 2329US6252309B1Packaged semiconductor substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 26, 2001·0 cites·3 claims
- 2423US6190529B1Method for plating gold to bond leads on a semiconductor substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 20, 2001·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →