Inventor · disambiguated record
Kuang-Hao Chiang
Also filed as: CHIANG KUANG-HAO
15 granted patents·11 pending applications·43 citations·filing 2014–2024
87Inventor score
Files withMACRONIX INT CO LTD11HON HAI PREC IND CO LTD7HON YOUNG SEMICONDUCTOR CORP7HON YOUNG SEMICONDUCTOR CORP HYS1
Top patents by PatentIndex Score
26 records- 0195US9461063B1Method for forming a semiconductor structureMACRONIX INT CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·15 claims
- 0294US9748262B1Memory structure and manufacturing method of the sameMACRONIX INT CO LTD·Filed 2016·Granted Aug 29, 2017·17 cites·18 claims
- 0384US12490450B2Manufacturing method of a semiconductor device with junction field effect transistorHON HAI PREC IND CO LTD·Filed 2023·Granted Dec 2, 2025·1 cites·20 claims
- 0472US9306160B2Memory device having oxygen control layers and manufacturing method of sameMACRONIX INT CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·13 claims
- 0570US12455195B2Infrared sensorHON HAI PREC IND CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 0668US12352629B2Bolometer and manufacturing method of temperature sensing unitHON HAI PREC IND CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0764US12061120B2Floating bridge structure and infrared sensing deviceHON HAI PREC IND CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 0864US9455402B2Resistive memory device with ring-shaped metal oxide on top surfaces of ring-shaped metal layer and barrier layerMACRONIX INT CO LTD·Filed 2015·Granted Sep 27, 2016·1 cites·7 claims
- 0957US10720426B2Three dimensional memory device and method for fabricating the sameMACRONIX INT CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·5 claims
- 1055US2025140690A1Semiconductor die and method for forming the sameHON YOUNG SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 1154US2025301700A1Semiconductor device and method for forming the sameHON YOUNG SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 1254US2025301698A1Semiconductor device and manufacturing method thereofHON YOUNG SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 1353US12249517B2Manufacturing method of semiconductor structureHON HAI PREC IND CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·19 claims
- 1453US2025294802A1Semiconductor device and method for forming the sameHON YOUNG SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 1551US12382673B2Method of making a fin field-effect transistor avoiding skewing and bending of the finsHON HAI PREC IND CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 1650US2024006486A1Semiconductor device and manufacturing method thereofHON HAI PREC IND CO LTD·Filed 2023·Application pending·0 cites
- 1750US2023114395A1Photodetector and integrated circuitHON YOUNG SEMICONDUCTOR CORP HYS·Filed 2022·Application pending·0 cites
- 1848US10170467B2Three dimensional memory device and method for fabricating the sameMACRONIX INT CO LTD·Filed 2015·Granted Jan 1, 2019·0 cites·9 claims
- 1947US2024079489A1Semiconductor device and manufacturing method thereofHON YOUNG SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 2044US2024120410A1Semiconductor structure and method of forming thereofHON YOUNG SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 2144US2024194790A1Semiconductor device and forming method thereofHON YOUNG SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 2242US10892010B2Method for controlling accumulated resistance property of ReRAM deviceMACRONIX INT CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·6 claims
- 2342US2020058859A1Resistive memory device and method for fabricating the sameMACRONIX INT CO LTD·Filed 2018·Application pending·0 cites
- 2439US9576972B2Semiconductor device and manufacturing method thereofMACRONIX INT CO LTD·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 2535US10074424B1Memory device, system and operating method thereofMACRONIX INT CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·18 claims
- 2634US2017047377A1Memory device and method for manufacturing the sameMACRONIX INT CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →