Inventor · disambiguated record
Kuo-Chan Chiou
Also filed as: CHIOU KUO-CHAN
26 granted patents·14 pending applications·44 citations·filing 2003–2021
93Inventor score
Top patents by PatentIndex Score
40 records- 0187US8530566B2Electrically insulating and thermally conductive composition and electronic deviceLIN CHEN-LUNG·Filed 2011·Granted Sep 10, 2013·5 cites·7 claims
- 0285US9708437B2Resin formulations, resin polymers and composite materials comprising the resin polymersIND TECH RES INST·Filed 2015·Granted Jul 18, 2017·2 cites·20 claims
- 0385US7662307B2Composition for thermal interface materialIND TECH RES INST·Filed 2006·Granted Feb 16, 2010·5 cites·14 claims
- 0484US9371233B2Polyamide-imides, graphite films and preparation for the graphite filmIND TECH RES INST·Filed 2014·Granted Jun 21, 2016·4 cites·9 claims
- 0582US11015018B2Resin composition and method for manufacturing thermally conductive materialIND TECH RES INST·Filed 2018·Granted May 25, 2021·2 cites·10 claims
- 0678US8465675B2Encapsulation materialKUAN MIN-TSUNG·Filed 2010·Granted Jun 18, 2013·4 cites·14 claims
- 0775US10626219B2Polymers and resin composition employing the sameIND TECH RES INST·Filed 2017·Granted Apr 21, 2020·2 cites·12 claims
- 0870US8911821B2Method for forming nanometer scale dot-shaped materialsLU CHUN-AN·Filed 2009·Granted Dec 16, 2014·3 cites·13 claims
- 0970US8039537B2Modified bismaleimide resins, preparation method thereof and compositions comprising the sameIND TECH RES INST·Filed 2010·Granted Oct 18, 2011·2 cites·12 claims
- 1066US8784697B2Conductive pastesCHIOU KUO-CHAN·Filed 2012·Granted Jul 22, 2014·1 cites·10 claims
- 1163US6809130B2Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the sameIND TECH RES INST·Filed 2003·Granted Oct 26, 2004·11 cites·11 claims
- 1262US8323553B2Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2009·Granted Dec 4, 2012·3 cites·7 claims
- 1361US11286333B2Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained therebyIND TECH RES INST·Filed 2019·Granted Mar 29, 2022·0 cites·14 claims
- 1461US10141083B2Transparent conductive film composite and transparent conductive filmIND TECH RES INST·Filed 2014·Granted Nov 27, 2018·0 cites·5 claims
- 1561US2014318414A1Nano-metal solution and nano-metal complex grainsIND TECH RES INST·Filed 2014·Application pending·0 cites
- 1660US10752744B2Thermally conductive resin, resin composition, prepreg, and copper clad laminateIND TECH RES INST·Filed 2017·Granted Aug 25, 2020·0 cites·9 claims
- 1759US11247978B2Reversible crosslinking reactant compositionIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 1859US10894853B2Furan-modified compound and oligomerIND TECH RES INST·Filed 2018·Granted Jan 19, 2021·0 cites·3 claims
- 1959US10858471B2Reversible crosslinking reactant compositionIND TECH RES INST·Filed 2018·Granted Dec 8, 2020·0 cites·11 claims
- 2059US2010166952A1Nano-metal solution, nano-metal complex grains and manufacturing method of metal filmIND TECH RES INST·Filed 2009·Application pending·0 cites
- 2157US9780236B2Conductive paste composition and method for manufacturing electrodeIND TECH RES INST·Filed 2014·Granted Oct 3, 2017·0 cites·6 claims
- 2254US11016385B2Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive compositionIND TECH RES INST·Filed 2018·Granted May 25, 2021·0 cites·16 claims
- 2353US10954329B2Modified copolymer, method for preparing the same, and method for preparing pasteIND TECH RES INST·Filed 2018·Granted Mar 23, 2021·0 cites·25 claims
- 2451US2021065026A1Material recommendation system and material recommendation methodIND TECH RES INST·Filed 2020·Application pending·0 cites
- 2551US2021376375A1Lithium ion battery, electrode of lithium ion battery, and electrode materialIND TECH RES INST·Filed 2021·Application pending·0 cites
- 2650US10329468B2Thermally conductive resin and thermal interface material comprising the sameIND TECH RES INST·Filed 2016·Granted Jun 25, 2019·0 cites·6 claims
- 2750US8889789B2Low dielectric constant resin formulation, prepolymer, composition, and composite thereofLIAO LU-SHIH·Filed 2012·Granted Nov 18, 2014·0 cites·15 claims
- 2850US2021065255A1Material property rating system and material property rating methodIND TECH RES INST·Filed 2020·Application pending·0 cites
- 2946US2009235754A1Encapsulation composition for pressure signal transmission and sensorIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3046US2007148469A1Encapsulation composition for pressure signal transmission and sensorTSENG FENG-PO·Filed 2006·Application pending·0 cites
- 3145US10059866B2Epoxy resin compositions and thermal interface materials comprising the sameIND TECH RES INST·Filed 2015·Granted Aug 28, 2018·0 cites·8 claims
- 3245US9308706B2Graphite oxide-containing resin formulation, composition, and composite thereofCHIOU KUO-CHAN·Filed 2012·Granted Apr 12, 2016·0 cites·3 claims
- 3343US8680196B2Halogen-free and phosphorus-free resin formulation and composite materials prepared therefromLIAO LU-SHIH·Filed 2011·Granted Mar 25, 2014·0 cites·8 claims
- 3442US2010219369A1Composition of thermal interface materialIND TECH RES INST·Filed 2010·Application pending·0 cites
- 3542US2014178823A1Photosensitive polyimide and negative type photoresist composition containing the sameIND TECH RES INST·Filed 2013·Application pending·0 cites
- 3640US2021104339A1Conductive composition and method for fabricating micro light-emitting diode displayIND TECH RES INST·Filed 2019·Application pending·0 cites
- 3739US2012009353A1Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2011·Application pending·0 cites
- 3836US2007142540A1Composition of thermal interface materialCHIOU KUO-CHAN·Filed 2006·Application pending·0 cites
- 3931US2011141698A1Heat spreading structureIND TECH RES INST·Filed 2010·Application pending·0 cites
- 4029US2017145247A1Packaging composition and packaging structure employing the sameIND TECH RES INST·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →