Inventor · disambiguated record
Ku Ho Chong
Also filed as: CHONG KU H · CHONG KU HO
4 granted patents·459 citations·filing 1994–1996
84Inventor score
Files withIBM4
Top patents by PatentIndex Score
4 records- 0193US5699613AFine dimension stacked vias for a multiple layer circuit board structureIBM·Filed 1995·Granted Dec 23, 1997·200 cites·10 claims
- 0292US5758413AMethod of manufacturing a multiple layer circuit board die carrier with fine dimension stacked viasIBM·Filed 1996·Granted Jun 2, 1998·159 cites·3 claims
- 0384US5493075AFine pitch solder formation on printed circuit board process and productIBM·Filed 1994·Granted Feb 20, 1996·55 cites·4 claims
- 0479US5535936AFine pitch solder formation on printed circuit board process and productIBM·Filed 1995·Granted Jul 16, 1996·45 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →