Inventor · disambiguated record
Kun-Yung Huang
Also filed as: HUANG KUN · HUANG KUN-YUNG
7 granted patents·5 pending applications·21 citations·filing 2004–2025
74Inventor score
Top patents by PatentIndex Score
12 records- 0187US10276545B1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 30, 2019·19 cites·20 claims
- 0272US10177058B1Encapsulating composition, semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jan 8, 2019·2 cites·20 claims
- 0348US2025364487A1Three-dimensional semiconductor package component and method for making the samePOWERTECH TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0446US11437336B2Semiconductor package structure with landing pads and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 6, 2022·0 cites·14 claims
- 0542US11289401B2Semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Mar 29, 2022·0 cites·12 claims
- 0642US11155113B2Holographic security element and method of forming thereofAGENCY SCIENCE TECH & RES·Filed 2018·Granted Oct 26, 2021·0 cites·16 claims
- 0735US10460959B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 29, 2019·0 cites·10 claims
- 0835US2020211980A1Fan-out package with warpage reduction and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0933US2018226442A1Image sensor and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1032US2019006305A1Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1128US10607856B2Manufacturing method of redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 31, 2020·0 cites·9 claims
- 1225US2005275422A1Integrated circuit device with compliant bumps and testing method for testing the integrated circuit deviceLUH SONG-PING·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →