Inventor · disambiguated record
Kuan-Chieh Huang
Also filed as: HUANG KUAN-CHIEH
65 granted patents·53 pending applications·198 citations·filing 1998–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD51GENESIS PHOTONICS INC41HUANG KUAN-CHIEH8QUANTA COMP INC4APH EPOWER CO LTD3
Top patents by PatentIndex Score
118 records- 0197US8247262B2Method for reducing contact resistance of CMOS image sensorHUANG KUAN-CHIEH·Filed 2010·Granted Aug 21, 2012·65 cites·20 claims
- 0296US9972603B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 15, 2018·19 cites·20 claims
- 0395US12507490B2Semiconductor device including germanium region disposed in semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·2 cites·20 claims
- 0495US10777539B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·9 cites·20 claims
- 0594US12015099B2Semiconductor sensor and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 0694US11855237B2Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·2 cites·20 claims
- 0793US8586404B2Method for reducing contact resistance of CMOS image sensorHUANG KUAN-CHIEH·Filed 2012·Granted Nov 19, 2013·15 cites·20 claims
- 0892US10510592B2Integrated circuit (IC) structure for high performance and functional densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·7 cites·20 claims
- 0988US12495632B2Semiconductor image sensor and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·20 claims
- 1086US11901393B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
- 1186US10475772B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·20 claims
- 1286US9859459B2Method for manufacturing light emitting unitGENESIS PHOTONICS INC·Filed 2015·Granted Jan 2, 2018·4 cites·19 claims
- 1386US8674469B2Isolation structure for backside illuminated image sensorHUANG KUAN-CHIEH·Filed 2010·Granted Mar 18, 2014·7 cites·18 claims
- 1486US2025359388A1Germanium-containing photodetector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1585US12396289B2Germanium-containing photodetector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1684US10608144B2Electrode pad structure of a light emitting diodeGENESIS PHOTONICS INC·Filed 2018·Granted Mar 31, 2020·3 cites·20 claims
- 1783US12166054B2Image sensor with passivation layer for dark current reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1883US2025359357A1Image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1983US2025048763A1Image sensor with passivation layer for dark current reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2082US12363969B2Passivation layer for epitaxial semiconductor processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2182US9356205B2Light emitting componentGENESIS PHOTONICS INC·Filed 2014·Granted May 31, 2016·2 cites·14 claims
- 2281US10734551B2Light emitting diodeGENESIS PHOTONICS INC·Filed 2019·Granted Aug 4, 2020·1 cites·19 claims
- 2381US10157895B2Seal-ring structure for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 2481US9705045B2Light emitting diode having distributed bragg reflectors (DBR) and manufacturing method thereofGENESIS PHOTONICS INC·Filed 2016·Granted Jul 11, 2017·3 cites·4 claims
- 2581US2025301736A1Passivation layer for epitaxial semiconductor processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2681US2025318297A1Cmos image sensors and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2780US12051763B2Germanium-containing photodetector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 2880US2025318287A1Semiconductor device including germanium region disposed in semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2979US12148853B2Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 3079US9219211B1Method for manufacturing light emitting unitGENESIS PHOTONICS INC·Filed 2014·Granted Dec 22, 2015·3 cites·13 claims
- 3178US11908900B2Passivation layer for epitaxial semiconductor processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 3278US9570431B1Semiconductor wafer for integrated packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·3 cites·20 claims
- 3378US2024387766A1Germanium-Based Sensor with Junction-Gate Field Effect Transistor and Method of Fabricating ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3478US2024387587A1Semiconductor image sensor and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3578US2025351611A1Image sensor packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3678US2024372028A1Method of manufacturing an optical sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3778US2024339555A1Semiconductor sensor and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3876US8791541B2Backside-illuminated image sensor having a supporting substrateHUANG KUAN-CHIEH·Filed 2012·Granted Jul 29, 2014·2 cites·19 claims
- 3976US2024145520A1Methods for fabricating image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4075US2025318311A1Bonding structures for stacked image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4174US11222814B2Integrated circuit (IC) structure for high performance and functional densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·1 cites·20 claims
- 4274USD763805SLight emitting diode chipGENESIS PHOTONICS INC·Filed 2015·Granted Aug 16, 2016·13 cites·1 claims
- 4374USD731989SLight emitting diode chipGENESIS PHOTONICS INC·Filed 2014·Granted Jun 16, 2015·15 cites·1 claims
- 4473US11848345B2Image sensor with passivation layer for dark current reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 4570US10453999B2Light emitting diodeGENESIS PHOTONICS INC·Filed 2018·Granted Oct 22, 2019·1 cites·16 claims
- 4669US12125934B2Method of manufacturing an optical sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 4769US11600737B2Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4869US11387167B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 4969US8605276B2Enhanced defect scanningWU CHIH-JEN·Filed 2011·Granted Dec 10, 2013·2 cites·18 claims
- 5069US2023141681A1Cmos image sensors and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →