Inventor · disambiguated record
Kuppusamy Kanakarajan
Also filed as: KANAKARAJAN KUPPUSAMY
15 granted patents·8 pending applications·393 citations·filing 1986–2020
93Inventor score
Files withDU PONT14KANAKARAJAN KARTHIKEYAN3KANAKARAJAN KUPPUSAMY3BECKS CHRISTOPHER ROBERT1RAYITEK HI TECH FILM COMPANY LTD SHENZHEN1
Top patents by PatentIndex Score
23 records- 0198US4780536AHexaazatriphenylene hexanitrile and its derivatives and their preparationsUNIV OHIO STATE RES FOUND·Filed 1986·Granted Oct 25, 1988·107 cites·7 claims
- 0295US7790276B2Aramid filled polyimides having advantageous thermal expansion properties, and methods relating theretoDU PONT·Filed 2006·Granted Sep 7, 2010·30 cites·2 claims
- 0394US5298331AFlexible multi-layer polyimide film laminates and preparation thereofDU PONT·Filed 1992·Granted Mar 29, 1994·144 cites·16 claims
- 0485US8440292B2Multi-layer article for flexible printed circuitsKANAKARAJAN KUPPUSAMY·Filed 2009·Granted May 14, 2013·8 cites·10 claims
- 0584US7579134B2Polyimide composite coverlays and methods and compositions relating theretoDU PONT·Filed 2005·Granted Aug 25, 2009·15 cites·12 claims
- 0681US7348080B2Low temperature polyimide adhesive compositions and methods relating theretoDU PONT·Filed 2005·Granted Mar 25, 2008·9 cites·5 claims
- 0781US5411765AFlexible multi-layer polyimide film laminates and preparation thereofDU PONT·Filed 1993·Granted May 2, 1995·53 cites·10 claims
- 0875US9303136B2Colored polyimide films and methods relating theretoBECKS CHRISTOPHER ROBERT·Filed 2012·Granted Apr 5, 2016·3 cites·11 claims
- 0974US8124223B2Aramid filled polyimides having advantageous thermal expansion properties, and methods relating theretoKANAKARAJAN KUPPUSAMY·Filed 2010·Granted Feb 28, 2012·3 cites·4 claims
- 1068US7026436B2Low temperature polyimide adhesive compositions and methods relating theretoDU PONT·Filed 2002·Granted Apr 11, 2006·18 cites·8 claims
- 1166US7348064B2Low temperature polyimide adhesive compositions and methods relating theretoDU PONT·Filed 2005·Granted Mar 25, 2008·3 cites·9 claims
- 1265US2009025867A1Multi-layer laminate substrates useful in electronic type applicationsDU PONT·Filed 2008·Application pending·0 cites
- 1358US2007298260A1Multi-layer laminate substrates useful in electronic type applicationsKANAKARAJAN KUPPUSAMY·Filed 2006·Application pending·0 cites
- 1455US2009242823A1Process for preparing polyimide based compositions useful in high frequency circuitry applicationsKANAKARAJAN KARTHIKEYAN·Filed 2007·Application pending·0 cites
- 1554US2009288699A1Laminate structures for high temperature photovoltaic applications, and methods relating theretoDU PONT·Filed 2009·Application pending·0 cites
- 1653US2009297858A1Multilayer insulation for wire, cable or other conductive materialsDU PONT·Filed 2008·Application pending·0 cites
- 1751US7476489B2Low-temperature curable photosensitive compositionsDU PONT·Filed 2005·Granted Jan 13, 2009·0 cites·15 claims
- 1850US7338715B2Low temperature cure polyimide compositions resistant to arc tracking and methods relating theretoDU PONT·Filed 2005·Granted Mar 4, 2008·0 cites·4 claims
- 1949US11827749B2Colorless transparent copolyamide-imide films with high modulus and low coefficient of thermal expansion and preparation thereofRAYITEK HI TECH FILM COMPANY LTD SHENZHEN·Filed 2020·Granted Nov 28, 2023·0 cites·12 claims
- 2049US2009142567A1Thermally conductive aramid-based dielectric substrates for printed circuit boards and integrated circuit chip packagingDU PONT·Filed 2008·Application pending·0 cites
- 2147US2007232734A1Polyimide based compositions useful in high frequency circuitry applications and methods relating theretoKANAKARAJAN KARTHIKEYAN·Filed 2006·Application pending·0 cites
- 2244US7524617B2Low-temperature curable photosensitive compositionsDU PONT·Filed 2004·Granted Apr 28, 2009·0 cites·9 claims
- 2342US2007231588A1Capacitive polyimide laminateKANAKARAJAN KARTHIKEYAN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →