Inventor · disambiguated record
Kuiwon Kang
Also filed as: KANG KUIWON
29 granted patents·32 pending applications·21 citations·filing 2013–2024
92Inventor score
Files withQUALCOMM INC61
Top patents by PatentIndex Score
61 records- 0190US9679841B2Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Granted Jun 13, 2017·11 cites·21 claims
- 0286US11444019B2Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the packageQUALCOMM INC·Filed 2020·Granted Sep 13, 2022·2 cites·28 claims
- 0380US10622292B2High density interconnects in an embedded trace substrate (ETS) comprising a core layerQUALCOMM INC·Filed 2018·Granted Apr 14, 2020·3 cites·30 claims
- 0477US10157824B2Integrated circuit (IC) package and package substrate comprising stacked viasQUALCOMM INC·Filed 2017·Granted Dec 18, 2018·3 cites·31 claims
- 0574US11404343B2Package comprising a substrate configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Aug 2, 2022·1 cites·30 claims
- 0666US10679919B2High thermal release interposerQUALCOMM INC·Filed 2018·Granted Jun 9, 2020·1 cites·20 claims
- 0761US12500146B2Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·23 claims
- 0860US2025294685A1Substrate with buried glass coreQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0960US2025300056A1Integrated device with conductive pillar structure for die interconnectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1059US2025246532A1Substrates including raised interconnects disposed on a die-side surface to support increased interconnect density and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1159US2025273597A1Embedded scaffold stiffener in substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1258US2025293147A1Package substrate with a reserve capacitorQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1357US11776888B2Package with a substrate comprising protruding pad interconnectsQUALCOMM INC·Filed 2021·Granted Oct 3, 2023·0 cites·34 claims
- 1457US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1557US2025379162A1Hybrid dtc embedding substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1656US9370097B2Package substrate with testing pads on fine pitch tracesQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·0 cites·31 claims
- 1756US2024371736A1Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1856US2025096111A1Package comprising a substrate with a passive component blockQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1956US2025300050A1Package substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2056US2025079348A1Package comprising a substrate with an embedded passive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2155US11791320B2Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Oct 17, 2023·0 cites·31 claims
- 2255US11764076B2Semi-embedded trace structure with partially buried tracesQUALCOMM INC·Filed 2020·Granted Sep 19, 2023·0 cites·20 claims
- 2355US2025070034A1Integrated device with embedded interconnect structureQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2454US2024371737A1Package substrate having electronic component mounted in a cavity of a core of the package substrate with a resinQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2553US11637057B2Uniform via pad structure having covered traces between partially covered padsQUALCOMM INC·Filed 2019·Granted Apr 25, 2023·0 cites·8 claims
- 2653US11527498B2Bump pad structureQUALCOMM INC·Filed 2020·Granted Dec 13, 2022·0 cites·28 claims
- 2753US10971455B2Ground shield plane for ball grid array (BGA) packageQUALCOMM INC·Filed 2019·Granted Apr 6, 2021·0 cites·7 claims
- 2852US12424559B2Package with a substrate comprising embedded escape interconnects and surface escape interconnectsQUALCOMM INC·Filed 2022·Granted Sep 23, 2025·0 cites·23 claims
- 2952US12362269B2Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Jul 15, 2025·0 cites·37 claims
- 3052US2025239508A1Interposer substrate with integrated step die cavity, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3152US2024373560A1Package substrate having embedded electronic component mounted on core of the package substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3252US2023352390A1Package comprising a substrate with a bump pad interconnect comprising a trapezoid shaped cross sectionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3352US2024079307A1Package comprising a substrate with post interconnects having a profile cross section of a trapezoid shapeQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3451US12354935B2Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 3551US11605595B2Packages with local high-density routing region embedded within an insulating layerQUALCOMM INC·Filed 2020·Granted Mar 14, 2023·0 cites·50 claims
- 3651US11552023B2Passive component embedded in an embedded trace substrate (ETS)QUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
- 3751US10879158B2Split conductive pad for device terminalQUALCOMM INC·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 3851US2024250009A1EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODSQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3949US11676905B2Integrated circuit (IC) package with stacked die wire bond connections, and related methodsQUALCOMM INC·Filed 2021·Granted Jun 13, 2023·0 cites·25 claims
- 4049US11552015B2Substrate comprising a high-density interconnect portion embedded in a core layerQUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 4149US11545439B2Package comprising an integrated device coupled to a substrate through a cavityQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·0 cites·30 claims
- 4249US11437335B2Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·29 claims
- 4349US2024373561A1Substrate having electronic component mounted in a cavity of a core using a plugging ink and method for making the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4449US2023073823A1Package comprising a substrate with high-density interconnectsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4549US2021375736A1Multicore substrateQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4648US11545435B2Double sided embedded trace substrateQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·0 cites·21 claims
- 4748US11075260B2Substrate comprising recessed interconnects and a surface mounted passive componentQUALCOMM INC·Filed 2018·Granted Jul 27, 2021·0 cites·24 claims
- 4847US2023114404A1Embedded trace substrate (ets) with embedded metal traces having multiple thickness for integrated circuit (ic) package height controlQUALCOMM INC·Filed 2022·Application pending·0 cites
- 4946US11342254B2Multi-dielectric structure in two-layer embedded trace substrateQUALCOMM INC·Filed 2020·Granted May 24, 2022·0 cites·17 claims
- 5046US10804195B2High density embedded interconnects in substrateQUALCOMM INC·Filed 2018·Granted Oct 13, 2020·0 cites·24 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →