Inventor · disambiguated record
Kunio Kodama
Also filed as: KODAMA KUNIO · TAKAMURA YOSHINORI
5 granted patents·324 citations·filing 1977–2000
85Inventor score
Top patents by PatentIndex Score
5 records- 0195US6344407B1Method of manufacturing solder bumps and solder joints using formic acidFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·75 cites·25 claims
- 0292US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 0381US5831441ATest board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor deviceFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·58 cites·2 claims
- 0453US5854558ATest board for testing a semiconductor device and method of testing the semiconductor deviceFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·25 cites·10 claims
- 0532US4190555ACatalyst system for polymerizing alpha-olefins and method of making sameMITSUI TOATSU CHEMICALS·Filed 1977·Granted Feb 26, 1980·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →