Inventor · disambiguated record
Kuniaki Koyama
Also filed as: KOYAMA KUNIAKI
20 granted patents·435 citations·filing 1990–1999
96Inventor score
Top patents by PatentIndex Score
20 records- 0189US5929524ASemiconductor device having ring-shaped conductive spacer which connects wiring layersNEC CORP·Filed 1996·Granted Jul 27, 1999·98 cites·13 claims
- 0288US5953609AMethod of manufacturing a semiconductor memory deviceNEC CORP·Filed 1997·Granted Sep 14, 1999·54 cites·30 claims
- 0386US5939746ASemiconductor memory device and manufacturing method of the sameNEC CORP·Filed 1996·Granted Aug 17, 1999·51 cites·23 claims
- 0481US6039958AStabilized live vaccineUNIV OSAKA RES FOUND·Filed 1998·Granted Mar 21, 2000·46 cites·10 claims
- 0570US5948411AStabilized live vaccineUNIV OSAKA RES FOUND·Filed 1994·Granted Sep 7, 1999·34 cites·10 claims
- 0664US6197682B1Structure of a contact hole in a semiconductor device and method of manufacturing the sameNEC CORP·Filed 1999·Granted Mar 6, 2001·26 cites·7 claims
- 0759US5610101AMethod of manufacturing a semiconductor device having improved coverage with increased wiring layersNEC CORP·Filed 1995·Granted Mar 11, 1997·22 cites·23 claims
- 0857US5486713ASemiconductor device having a capacitorNEC CORP·Filed 1995·Granted Jan 23, 1996·18 cites·9 claims
- 0948US5124767ADynamic random access memory cell with improved stacked capacitorNEC CORP·Filed 1990·Granted Jun 23, 1992·13 cites·10 claims
- 1045US5514910ASemiconductor device having multi-level interconnection structureNEC CORP·Filed 1994·Granted May 7, 1996·14 cites·9 claims
- 1143US5604382ASemiconductor device with pillar-shaped contact layerNEC CORP·Filed 1994·Granted Feb 18, 1997·12 cites·21 claims
- 1240US5447883AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1994·Granted Sep 5, 1995·10 cites·2 claims
- 1338US5780310AMethod of fabricating a memory cell array area and a peripheral circuit areaNEC CORP·Filed 1995·Granted Jul 14, 1998·4 cites·1 claims
- 1438US5068698AMOS semiconductor device having high-capacity stacked capacitorNEC CORP·Filed 1990·Granted Nov 26, 1991·7 cites·3 claims
- 1537US5451269ASemiconductor memory device including an improved substrate structure and method of fabricating the sameNEC CORP·Filed 1994·Granted Sep 19, 1995·4 cites·5 claims
- 1637US5348904AMethod of fabricating semiconductor memory device including an improved substrate structureNEC CORP·Filed 1992·Granted Sep 20, 1994·4 cites·4 claims
- 1736US5554864ASemiconductor device having improved coverage with increased wiring layersNEC CORP·Filed 1994·Granted Sep 10, 1996·6 cites·24 claims
- 1835US5536682AMethod for manufacturing a semiconductor deviceNEC CORP·Filed 1995·Granted Jul 16, 1996·4 cites·4 claims
- 1934US5451819ASemiconductor device having conductive plug projecting from contact hole and connected at side surface thereof to wiring layerNEC CORP·Filed 1993·Granted Sep 19, 1995·6 cites·8 claims
- 2032US5581124ASemiconductor device having wiring and contact structureNEC CORP·Filed 1995·Granted Dec 3, 1996·2 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →