Inventor · disambiguated record

Kuan-Liang Lai

Also filed as: LAI KUAN-LIANG

4 granted patents·0 citations·filing 2014–2019

57Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD4

Top patents by PatentIndex Score

4 records

0162US11004741B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
0258US10566237B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
0355US10163705B2Profile of through via protrusion in 3DIC interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·0 cites·20 claims
0450US11171100B2Semiconductor device structure with protected bump and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →