Inventor · disambiguated record
Kunsil Lee
Also filed as: LEE KUNSIL
8 granted patents·3 pending applications·15 citations·filing 2017–2024
81Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0192US11935868B2Semiconductor package including plurality of semiconductor chips and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·19 claims
- 0287US10665571B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 26, 2020·5 cites·12 claims
- 0386US9941252B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 10, 2018·5 cites·20 claims
- 0474US12400998B2Semiconductor package including plurality of semiconductor chips and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·13 claims
- 0573US11908727B2Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0671US10825710B2Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 3, 2020·1 cites·18 claims
- 0768US11631608B2Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·18 claims
- 0863US2023005872A1Adhesive sheet and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0960US2025343064A1Method of fabricating a semiconductor package and a semiconductor package fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US10256215B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·20 claims
- 1152US2024014049A1Release film for mold process, and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →