Inventor · disambiguated record
Kuei-Pin Lee
Also filed as: LEE KUEI PIN
8 granted patents·27 citations·filing 2012–2019
83Inventor score
Top patents by PatentIndex Score
8 records- 0191US8722531B1Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 13, 2014·13 cites·21 claims
- 0282US8778801B2Method for forming seed layer structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 15, 2014·8 cites·13 claims
- 0380US8872342B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 28, 2014·4 cites·22 claims
- 0472US9892963B2Device and method for reducing contact resistance of a metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·1 cites·20 claims
- 0571US9159666B2Device and method for reducing contact resistance of a metalTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 13, 2015·1 cites·20 claims
- 0666US11177168B2Device and method for reducing contact resistance of a metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 0762US10276431B2Device and method for reducing contact resistance of a metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 0855US9064934B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 23, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →