Inventor · disambiguated record

Kuang-Chun Lee

Also filed as: Lee Kuang-Chun

23 granted patents·12 pending applications·56 citations·filing 2016–2025

93Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD35

Top patents by PatentIndex Score

35 records

0196US9653391B1Semiconductor packaging structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
0294US12327782B2Systems for semiconductor package mounting with improved co-planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
0394US9870975B1Chip package with thermal dissipation structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·12 cites·20 claims
0493US11764118B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
0589US12512331B2Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·20 claims
0687US11694974B2Semiconductor die with warpage release layer structure in package and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·1 cites·20 claims
0786US10790164B1Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
0886US10276551B2Semiconductor device package and method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·14 claims
0985US12300632B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
1084US10714463B2Method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
1184US9748156B1Semiconductor package assembly, semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
1284US2025336884A1Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1383US2025323106A1Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1482US12444706B2Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
1582US10504880B2Method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 10, 2019·2 cites·20 claims
1680US12283553B2Semiconductor die with warpage release layer structure in package and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
1780US2025364353A1Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1879US12119276B2Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
1979US11855009B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
2079US2025349670A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2178US2025349749A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2278US2024379475A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2376US12368080B2Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
2476US2025210543A1Semiconductor die with warpage release layer structure in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2573US11410939B2Chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
2672US2025266338A1Systems for semiconductor package mounting with improved co-planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2771US11508710B2Method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
2870US11978720B2Semiconductor device package and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
2968US11728233B2Chip package structure with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
3065US2023411307A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3165US2023395461A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3261US10797006B2Structure and formation method of chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·20 claims
3356US10163816B2Structure and formation method of chip package with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
3456US2024290683A1Package lid including a multi-layer structure for heat dissipation and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3554US2024071950A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →