Inventor · disambiguated record
Kuei-Chen Liang
Also filed as: LIANG KUEI-CHEN
4 granted patents·2 pending applications·26 citations·filing 2002–2012
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0177US8916980B2Pad and circuit layout for semiconductor devicesDAI TIEJUN·Filed 2012·Granted Dec 23, 2014·5 cites·19 claims
- 0260US6933600B2Substrate for semiconductor packageSILICON INTEGRATED SYS CORP·Filed 2002·Granted Aug 23, 2005·10 cites·5 claims
- 0358US6765301B2Integrated circuit bonding device and manufacturing method thereofSILICON INTEGRATED SYS CORP·Filed 2002·Granted Jul 20, 2004·9 cites·4 claims
- 0445US6744128B2Integrated circuit package capable of improving signal qualitySILICON INTEGRATED SYS CORP·Filed 2002·Granted Jun 1, 2004·2 cites·11 claims
- 0535US2006226534A1Structure and assembly method of integrated circuit packageSILICON INTEGRATED SYS CORP·Filed 2006·Application pending·0 cites
- 0634US2003067048A1Integrated circuit deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →