Inventor · disambiguated record
Kun-Yen Liao
Also filed as: LIAO KUN-YEN
0 granted patents·7 pending applications·0 citations·filing 2024–2025
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
Top patents by PatentIndex Score
7 records- 0180US2025343148A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0279US2025349649A1Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0374US2025357264A1Heat dissipation by nano pipesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0473US2025226278A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0573US2025140697A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0666US2025140644A1Heat dissipation by nano pipesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0760US2025239449A1Semiconductor device structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kun-Yen Liao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →