Inventor · disambiguated record
Kuang-Ho Liao
Also filed as: LIAO KUANG-HO
6 granted patents·142 citations·filing 1998–2002
85Inventor score
Files withVANGUARD INT SEMICONDUCT CORP6
Top patents by PatentIndex Score
6 records- 0185US6458617B1Multi-chip semiconductor package structureVANGUARD INT SEMICONDUCT CORP·Filed 2001·Granted Oct 1, 2002·42 cites·19 claims
- 0267US6245598B1Method for wire bonding a chip to a substrate with recessed bond pads and devices formedVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jun 12, 2001·36 cites·8 claims
- 0362US6122822AMethod for balancing mold flow in encapsulating devicesVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Sep 26, 2000·29 cites·15 claims
- 0458US6844616B2Multi-chip semiconductor package structureVANGUARD INT SEMICONDUCT CORP·Filed 2002·Granted Jan 18, 2005·7 cites·1 claims
- 0549US6075281AModified lead finger for wire bondingVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jun 13, 2000·16 cites·14 claims
- 0646US6220102B1Die-shear test fixture apparatusVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Apr 24, 2001·12 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →