Inventor · disambiguated record
Kuo-Yin Lin
Also filed as: LIN KUO YIN
33 granted patents·1 pending application·86 citations·filing 2003–2022
96Inventor score
Top patents by PatentIndex Score
34 records- 0195US8889497B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·22 cites·20 claims
- 0294US9768303B2Method and structure for FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·7 cites·20 claims
- 0391US9236446B2Barc-assisted process for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·10 cites·20 claims
- 0489US9592585B2System and method for CMP station cleanlinessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Mar 14, 2017·8 cites·12 claims
- 0587US9048087B2Methods for wet clean of oxide layers over epitaxial layersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·8 cites·20 claims
- 0686US10160091B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0784US11865666B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0882US11529712B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·17 claims
- 0981US7189957B2Methods to improve photonic performances of photo-sensitive integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 13, 2007·6 cites·18 claims
- 1075US9287127B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 15, 2016·2 cites·20 claims
- 1174US10868180B2Method and structure for FinFET devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1273US9852899B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·1 cites·20 claims
- 1372US10461080B2Method for manufacturing a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·1 cites·20 claims
- 1471US11312882B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1571US9559021B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 31, 2017·1 cites·20 claims
- 1670US9748109B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·1 cites·20 claims
- 1769US9153657B2Semiconductor devices comprising a finTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 6, 2015·2 cites·20 claims
- 1865US10714615B2Method and structure for FinFET devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 1963US10164102B2Method and structure for FinFET devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 2061US9954105B2Method and structure for FinFET devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 24, 2018·0 cites·20 claims
- 2160US11031391B2Method for manufacturing a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 2259US7169713B2Atomic layer deposition (ALD) method with enhanced deposition rateTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 30, 2007·6 cites·12 claims
- 2357US11011385B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 18, 2021·0 cites·20 claims
- 2457US10774241B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·20 claims
- 2557US7199001B2Method of forming MIM capacitor electrodesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 3, 2007·7 cites·10 claims
- 2656US10279311B2System and method for operating chemical mechanical polishing processPENG CHIH I·Filed 2012·Granted May 7, 2019·1 cites·20 claims
- 2754US9567493B2CMP slurry solution for hardened fluid materialLIN KUO-YIN·Filed 2014·Granted Feb 14, 2017·0 cites·19 claims
- 2853US9478431B2BARC-assisted process for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 2945US8853083B2Chemical mechanical polish in the growth of semiconductor regionsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·0 cites·20 claims
- 3044US9508716B2Methods of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·0 cites·20 claims
- 3144US9064959B2Method and apparatus for forming a CMOS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·0 cites·20 claims
- 3241US7786552B2Semiconductor device having hydrogen-containing layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 31, 2010·0 cites·15 claims
- 3337US9937536B2Air purge cleaning for semiconductor polishing apparatusLIN KUO YIN·Filed 2012·Granted Apr 10, 2018·0 cites·20 claims
- 3437US2005112876A1Method to form a robust TiCI4 based CVD TiN filmFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →