Inventor · disambiguated record
Kuo-Wei Lin
Also filed as: LIN KUO-WEI
25 granted patents·7 pending applications·792 citations·filing 2000–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG25ROYALTEK COMPANY LTD3MEDIATEK INC1METAL IND RES & DEV CT1UNIV NATIONAL CHIAO TUNG1
Top patents by PatentIndex Score
32 records- 0196US6482669B1Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·81 cites·13 claims
- 0296US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
- 0393US6605524B1Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·78 cites·24 claims
- 0493US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
- 0591US7183598B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·10 cites·17 claims
- 0691US6632700B1Method to form a color image sensor cell while protecting the bonding pad structure from damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 14, 2003·58 cites·20 claims
- 0786US6958546B2Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·45 cites·9 claims
- 0885US6956292B2Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·37 cites·20 claims
- 0983US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 1082US10082349B2Heat conducting moduleUNIV NATIONAL CHIAO TUNG·Filed 2016·Granted Sep 25, 2018·4 cites·7 claims
- 1182US6649507B1Dual layer photoresist method for fabricating a mushroom bumping plating structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·33 cites·25 claims
- 1280US8942099B2Method and apparatus of IP flow mobility in 4G wireless communication networksMEDIATEK INC·Filed 2012·Granted Jan 27, 2015·8 cites·20 claims
- 1378US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims
- 1476US7485906B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·2 cites·20 claims
- 1575US6977213B1IC chip solder bump structure and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 20, 2005·19 cites·16 claims
- 1675US6756184B2Method of making tall flip chip bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 29, 2004·29 cites·20 claims
- 1775US6372545B1Method for under bump metal patterning of bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·22 cites·35 claims
- 1875US6319846B1Method for removing solder bodies from a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 20, 2001·26 cites·20 claims
- 1973US6876049B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·12 cites·20 claims
- 2067US7119002B2Solder bump composition for flip chipTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 10, 2006·13 cites·6 claims
- 2167US6534396B1Patterned conductor layer pasivation method with dimensionally stabilized planarizationTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Mar 18, 2003·20 cites·14 claims
- 2262US6426283B1Method for bumping and backlapping a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 30, 2002·10 cites·18 claims
- 2361US2025216503A1Ultra-wide angle radar systemROYALTEK COMPANY LTD·Filed 2024·Application pending·0 cites
- 2458US7884471B2Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 8, 2011·1 cites·20 claims
- 2556US12227983B2Automatic vehicle-door activating sensing system and method thereforROYALTEK COMPANY LTD·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
- 2645US2006285433A1Fluidic mixer of serpentine channel incorporated with staggered sudden-expansion and convergent cross sectionsYANG JING-TANG·Filed 2005·Application pending·0 cites
- 2741US2015267966A1Adaptable heat exchanger and fabrication method thereofMETAL IND RES & DEV CT·Filed 2014·Application pending·0 cites
- 2839US2005258536A1Chip heat sink device and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 2936US2006046434A1Method for reducing lead precipitation during wafer processingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3035US2008013605A1Method of GPS bit synchronizationROYALTEK COMPANY LTD·Filed 2006·Application pending·0 cites
- 3134US2006087039A1Ubm structure for improving reliability and performanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3228US6784002B1Method to make wafer laser marks visable after bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·1 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →