Inventor · disambiguated record
Kun-Hsieh Liu
Also filed as: LIU KUN · LIU KUN-HSIEH
9 granted patents·2 pending applications·36 citations·filing 2005–2018
84Inventor score
Top patents by PatentIndex Score
11 records- 0186US7643081B2Digital camera module with small sized image sensor chip packageALTUS TECHNOLOGY INC·Filed 2006·Granted Jan 5, 2010·11 cites·3 claims
- 0274US7365421B2IC chip package with isolated viasALTUS TECHNOLOGY INC·Filed 2005·Granted Apr 29, 2008·7 cites·10 claims
- 0371US7646429B2Digital camera module packaging methodALTUS TECHNOLOGY INC·Filed 2006·Granted Jan 12, 2010·3 cites·16 claims
- 0470US7595839B2Image sensor chip packaging methodALTUS TECHNOLOGY INC·Filed 2006·Granted Sep 29, 2009·5 cites·19 claims
- 0568US7342215B2Digital camera module package fabrication methodALTUS TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·4 cites·19 claims
- 0667US7540672B2Digital still camera moduleALTUS TECHNOLOGY INC·Filed 2005·Granted Jun 2, 2009·4 cites·19 claims
- 0760US7417327B2IC chip package with coverALTUS TECHNOLOGY INC·Filed 2005·Granted Aug 26, 2008·2 cites·18 claims
- 0847US10775659B2Array substrate, display device and driving method thereofBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·18 claims
- 0946US2020306747A1Sample analysis chip and fabricating method thereofBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2018·Application pending·0 cites
- 1043US7592197B2Image sensor chip package fabrication methodALTUS TECHNOLOGY INC·Filed 2006·Granted Sep 22, 2009·0 cites·14 claims
- 1140US2006273249A1Image sensor chip package and method of manufacturing the sameALTUS TECHNOLOGY INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →