Inventor · disambiguated record

Kuo-Chio Liu

Also filed as: LIU KUO-CHIO

46 granted patents·13 pending applications·272 citations·filing 1999–2025

97Inventor score

Technology areasH10W H10D H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD45 TAIWAN SEMICONDUCTOR MFG14

Top patents by PatentIndex Score

59 records

0193US10014218B1Method for forming semiconductor device structure with bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 3, 2018·13 cites·20 claims
0293US9209048B2Two step molding grinding for packaging applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
0389US12512331B2Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·20 claims
0489US10522526B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·5 cites·20 claims
0588US6323074B1High voltage ESD protection device with very low snapback voltage by adding as a p+ diffusion and n-well to the NMOS drainTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 27, 2001·44 cites·5 claims
0687US10535554B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·3 cites·20 claims
0787US6066879ACombined NMOS and SCR ESD protection deviceTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 23, 2000·75 cites·14 claims
0886US10546845B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·3 cites·20 claims
0985US12334489B2Lthc as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
1084US12183709B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
1183US2024363398A1Semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1282US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
1382US11088108B2Chip package structure including ring-like structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
1482US10163849B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
1582US2024355795A1Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1681US2025364521A1Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1780US11437361B2LTHC as charging barrier in InFO package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·20 claims
1880US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
1980US2025364353A1Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2079US11848302B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
2179US6459127B1Uniform current distribution SCR device for high voltage ESD protectionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 1, 2002·26 cites·5 claims
2279US2025349670A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2379US2024297138A1Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2478US11923353B2LTHC as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
2578US2025349749A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2677US11211318B2Bump layout for coplanarity improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·19 claims
2776US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
2876US10170429B2Method for forming package structure including intermetallic compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·3 cites·20 claims
2975US12046588B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
3075US11984419B2Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
3173US12087618B2Method for forming semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
3273US11545463B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
3371US12463192B2Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
3471US10115686B2Semiconductor structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·2 cites·20 claims
3570US11404341B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
3670US11069652B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
3770US11004728B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
3870US6569730B2High voltage transistor using P+ buried layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 27, 2003·13 cites·2 claims
3969US11594484B2Forming bonding structures by using template layer as templatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·20 claims
4069US6358781B1Uniform current distribution SCR device for high voltage ESD protectionTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Mar 19, 2002·14 cites·5 claims
4168US11469203B2Method for forming package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
4265US2023411307A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4365US2023395461A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4464US11257797B2Package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
4563US10535629B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
4662US7091535B2High voltage device embedded non-volatile memory cell and fabrication methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 15, 2006·12 cites·26 claims
4758US10811377B2Package structure with a barrier layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
4858US10700001B2Forming bonding structures by using template layer as templatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
4957US6590262B2High voltage ESD protection device with very low snapback voltageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 8, 2003·7 cites·10 claims
5056US2024332212A1Package structure including ring structure attached by hybrid adhesive and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

Showing the top 50 of 59 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Kuo-Chio Liu files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →