Inventor · disambiguated record
Kuang-Lin Lo
Also filed as: LO KUANG-LIN
10 granted patents·6 pending applications·279 citations·filing 1999–2006
89Inventor score
Top patents by PatentIndex Score
16 records- 0192US7473629B2Substrate structure having a solder mask and a process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·30 cites·9 claims
- 0290US6118176AStacked chip assembly utilizing a lead frameADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Sep 12, 2000·153 cites·3 claims
- 0372US7384566B2Fabrication method for printed circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jun 10, 2008·7 cites·10 claims
- 0468US6093960ASemiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performanceADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jul 25, 2000·43 cites·3 claims
- 0564US6163076AStacked structure of semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Dec 19, 2000·35 cites·5 claims
- 0663US7511366B2Multi-row substrate strip and method for manufacturing the sameASE SHANGHAI INC·Filed 2005·Granted Mar 31, 2009·3 cites·20 claims
- 0753US6627481B2Method of manufacturing a semiconductor package with a lead frame having a support structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 30, 2003·7 cites·2 claims
- 0849US6942478B2Packaging mold with electrostatic discharge protectionADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 13, 2005·1 cites·3 claims
- 0948US7144239B2Molding apparatus with a molding flowability sensor for packaging semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Dec 5, 2006·0 cites·3 claims
- 1045US2007220742A1Method for fabricating identification codeADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1144US2007087480A1Chip package methodADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1243US2005282314A1Printed circuit boards and methods for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1343US2005089593A1Molding apparatus with a pressure sensor for packaging semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 1438US2006091384A1Substrate testing apparatus with full contact configurationADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1534US6777793B2Packaging substrate with electrostatic discharge protectionADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Aug 17, 2004·0 cites·2 claims
- 1634US2004124515A1[chip package structure and method for manufacturing the same]Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →