Inventor · disambiguated record
Kumar Nagarajan
Also filed as: NAGARAJAN KUMAR
28 granted patents·6 pending applications·325 citations·filing 1999–2025
96Inventor score
Top patents by PatentIndex Score
34 records- 0191US9136258B1Stacked LED for optical sensor devicesMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Sep 15, 2015·19 cites·17 claims
- 0291US7791192B1Circuit for and method of implementing a capacitor in an integrated circuitXILINX INC·Filed 2006·Granted Sep 7, 2010·25 cites·20 claims
- 0388US8084297B1Method of implementing a capacitor in an integrated circuitJOSHI MUKUL·Filed 2010·Granted Dec 27, 2011·11 cites·20 claims
- 0484US8841752B1Semiconductor structure and method for interconnection of integrated circuitsCHAWARE RAGHUNANDAN·Filed 2011·Granted Sep 23, 2014·9 cites·11 claims
- 0584US8258013B1Integrated circuit assembly having vented heat-spreaderNAGARAJAN KUMAR·Filed 2010·Granted Sep 4, 2012·13 cites·11 claims
- 0683US9354111B2Wafer level lens in packageMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted May 31, 2016·5 cites·19 claims
- 0783US6519844B1Overmold integrated circuit packageLSI LOGIC CORP·Filed 2001·Granted Feb 18, 2003·36 cites·9 claims
- 0883US6133064AFlip chip ball grid array package with laminated substrateLSI LOGIC CORP·Filed 1999·Granted Oct 17, 2000·72 cites·6 claims
- 0982US8519528B1Semiconductor structure and method for interconnection of integrated circuitsNAGARAJAN KUMAR·Filed 2011·Granted Aug 27, 2013·7 cites·12 claims
- 1082US6441499B1Thin form factor flip chip ball grid arrayLSI LOGIC CORP·Filed 2000·Granted Aug 27, 2002·33 cites·7 claims
- 1178US9397027B1Sacrificial pad on semiconductor package device and methodMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jul 19, 2016·5 cites·19 claims
- 1276US8810028B1Integrated circuit packaging devices and methodsZOHNI NAEL·Filed 2010·Granted Aug 19, 2014·6 cites·15 claims
- 1374US7187077B1Integrated circuit having a lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2004·Granted Mar 6, 2007·17 cites·15 claims
- 1473US2025286027A1System packaging for cellular modem and transceiver system of heterogeneous stackingAPPLE INC·Filed 2025·Application pending·0 cites
- 1573US2025183127A1Molded Silicon on Passive PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 1670US12315853B2System packaging for cellular modem and transceiver system of heterogeneous stackingAPPLE INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1768US7473583B1Integrated circuit having a lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2007·Granted Jan 6, 2009·3 cites·10 claims
- 1867US12165956B2Molded silicon on passive packageAPPLE INC·Filed 2021·Granted Dec 10, 2024·0 cites·15 claims
- 1967US6639321B1Balanced coefficient of thermal expansion for flip chip ball grid arrayLSI LOGIC CORP·Filed 2000·Granted Oct 28, 2003·13 cites·6 claims
- 2065US9443815B2Embedded die redistribution layers for active deviceMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Sep 13, 2016·2 cites·11 claims
- 2163US9627573B2Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrateMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Apr 18, 2017·1 cites·18 claims
- 2258US2025096096A1Electronic Package Molded Vertical InterconnectionAPPLE INC·Filed 2023·Application pending·0 cites
- 2357US8410604B2Lead-free structures in a semiconductor deviceYIP LAURENE·Filed 2010·Granted Apr 2, 2013·2 cites·18 claims
- 2457US6963129B1Multi-chip package having a contiguous heat spreader assemblyLSI LOGIC CORP·Filed 2003·Granted Nov 8, 2005·8 cites·6 claims
- 2555US6320127B1Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component packageLSI LOGIC CORP·Filed 1999·Granted Nov 20, 2001·21 cites·23 claims
- 2654US2025328010A1Light Projector Module with Directly Bonded and Orthogonal Rigid ComponentsAPPLE INC·Filed 2025·Application pending·0 cites
- 2752US7190082B2Low stress flip-chip package for low-K silicon technologyLSI LOGIC CORP·Filed 2003·Granted Mar 13, 2007·5 cites·12 claims
- 2852US6911736B2Electrostatic discharge protectionLSI LOGIC CORP·Filed 2003·Granted Jun 28, 2005·5 cites·16 claims
- 2951US6943446B2Via construction for structural supportLSI LOGIC CORP·Filed 2002·Granted Sep 13, 2005·4 cites·4 claims
- 3046US6806119B2Method of balanced coefficient of thermal expansion for flip chip ball grid arrayLSI LOGIC CORP·Filed 2003·Granted Oct 19, 2004·2 cites·9 claims
- 3145US2015380627A1Lid assembly for thermopile temperature sensing device in thermal gradient environmentQUALCOMM TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 3243US6825066B2Stiffener designLSI LOGIC CORP·Filed 2002·Granted Nov 30, 2004·1 cites·20 claims
- 3338US10461066B2Structure and method for hybrid optical package with glass top coverMAXIM INTEGRATED PRODUCTS·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 3436US2004070073A1Underfill gap enhancementFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →