Inventor · disambiguated record
Kun-Bae Noh
Also filed as: NOH KUN-BAE
8 granted patents·3 pending applications·17 citations·filing 2006–2024
78Inventor score
Top patents by PatentIndex Score
11 records- 0189US8921019B2Positive photosensitive resin composition, and photosensitive resin layer and display device using the sameKWON JI-YUN·Filed 2012·Granted Dec 30, 2014·9 cites·14 claims
- 0286US9405188B2Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display deviceSAMSUNG SDI CO LTD·Filed 2014·Granted Aug 2, 2016·5 cites·9 claims
- 0374US9323147B2Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display deviceSAMSUNG SDI CO LTD·Filed 2014·Granted Apr 26, 2016·2 cites·9 claims
- 0463US8987342B2Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the sameCHEIL IND INC·Filed 2013·Granted Mar 24, 2015·1 cites·6 claims
- 0558US2025223479A1Cmp slurry composition for polishing tungsten and method for polishing tungsten using the sameSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0653US2015291842A1Positive Photosensitive Resin Composition, Photosensitive Resin Film and Display Device Using the SameSAMSUNG SDI CO LTD·Filed 2014·Application pending·0 cites
- 0745US9482943B2Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the sameCHEIL IND INC·Filed 2014·Granted Nov 1, 2016·0 cites·13 claims
- 0843US2015118622A1Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display DeviceCHEIL IND INC·Filed 2014·Application pending·0 cites
- 0939US10020185B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·16 claims
- 1039US8735029B2Positive photosensitive resin composition, and display device and organic light emitting device using the sameYOON EUN-KYUNG·Filed 2012·Granted May 27, 2014·0 cites·9 claims
- 1137US7825528B2Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the sameCHEIL IND INC·Filed 2006·Granted Nov 2, 2010·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →