Inventor · disambiguated record
Kunsang Park
Also filed as: PARK KUNSANG
9 granted patents·3 pending applications·19 citations·filing 2012–2025
82Inventor score
Top patents by PatentIndex Score
12 records- 0194US11342221B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·4 cites·19 claims
- 0290US12249558B2Semiconductor device including penetration via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 11, 2025·1 cites·12 claims
- 0382US9153559B2Semiconductor devices including through silicon via electrodes and methods of fabricating the sameLEE DOSUN·Filed 2012·Granted Oct 6, 2015·8 cites·19 claims
- 0471US9543200B2Methods for fabricating semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 10, 2017·3 cites·15 claims
- 0571US8872351B2Semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·3 cites·6 claims
- 0671US2025183121A1Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0768US11728245B2Semiconductor device and semiconductor package including penetration via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 0861US11600553B2Semiconductor device including through substrate vias and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 0958US11101196B2Semiconductor device including through substrate vias and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·18 claims
- 1057US2024312935A1Bonding semiconductor device, and chip for bonding semiconductor device and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1156US2024038708A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1252US12500189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →