Inventor · disambiguated record
Kunito Sakai
Also filed as: SAKAI KUNITO
10 granted patents·472 citations·filing 1984–1996
92Inventor score
Files withMITSUBISHI ELECTRIC CORP10
Top patents by PatentIndex Score
10 records- 0196US4769344AMethod of resin encapsulating a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Sep 6, 1988·176 cites·8 claims
- 0286US4697203ASemiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Sep 29, 1987·67 cites·7 claims
- 0385US4717948ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Jan 5, 1988·62 cites·5 claims
- 0475US4812420AMethod of producing a semiconductor device having a light transparent windowMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Mar 14, 1989·45 cites·21 claims
- 0569US5082615AMethod for packaging semiconductor devices in a resinMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 21, 1992·36 cites·12 claims
- 0666US5395226AMolding machine and methodMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Mar 7, 1995·33 cites·6 claims
- 0754US5597523AMolding apparatus and method in which a mold cavity gasket is deformed by separately applied pressureMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 28, 1997·18 cites·23 claims
- 0853US5798070AEncapsulation methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 25, 1998·18 cites·12 claims
- 0950US4963307AMethod for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tabletMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Oct 16, 1990·13 cites·6 claims
- 1030US4826931ATablet for resin-molding semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1987·Granted May 2, 1989·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →