Inventor · disambiguated record
Kuljeet Singh
Also filed as: SINGH KULJEET
8 granted patents·2 pending applications·104 citations·filing 1999–2021
88Inventor score
Top patents by PatentIndex Score
10 records- 0182US7247517B2Method and apparatus for a dual substrate packageINTEL CORP·Filed 2003·Granted Jul 24, 2007·37 cites·15 claims
- 0268US6764877B2Method of dissipating static electric charge from a chip assembly during a manufacturing operationINTEL CORP·Filed 2003·Granted Jul 20, 2004·13 cites·4 claims
- 0365US6715663B2Wire-bond process flow for copper metal-six, structures achieved thereby, and testing methodINTEL CORP·Filed 2002·Granted Apr 6, 2004·11 cites·13 claims
- 0462US7064431B2Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contactsINTEL CORP·Filed 2004·Granted Jun 20, 2006·9 cites·4 claims
- 0562US6404067B1Plastic ball grid array package with improved moisture resistanceINTEL CORP·Filed 2000·Granted Jun 11, 2002·12 cites·13 claims
- 0661US6885102B2Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contactsINTEL CORP·Filed 2002·Granted Apr 26, 2005·9 cites·19 claims
- 0747US6566741B2Grounding of package substratesINTEL CORP·Filed 1999·Granted May 20, 2003·12 cites·10 claims
- 0845US2022292386A1Method and system for machine learning based user experience evaluation for information technology support servicesACCENTURE GLOBAL SOLUTIONS LTD·Filed 2021·Application pending·0 cites
- 0941US7282796B2Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contactsINTEL CORP·Filed 2004·Granted Oct 16, 2007·1 cites·1 claims
- 1039US2004192019A1Wire-bond process flow for copper metal-six, structures achieved thereby, and testing methodINTEL CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →