Inventor · disambiguated record
Kumar Abhishek Singh
Also filed as: SINGH KUMAR · Singh Kumar Abhishek
3 granted patents·21 pending applications·3 citations·filing 2015–2024
52Inventor score
Files withINTEL CORP24
Top patents by PatentIndex Score
24 records- 0180US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 0259US2025306281A1Adhesive-free expanded beam fiber array unit (fau)INTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2025306285A1Passive lens array structure for photonic integrated circuit (pic)INTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2025309030A1Microelectronic structures including ihs coupling enhancement structures for thermal degradation mitigationINTEL CORP·Filed 2024·Application pending·0 cites
- 0557US2025306303A1Photonic integrated circuit packages including an on-package expanded beam connector for detachable fiber arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US2025306302A1Photonic integrated circuit packages including an on-package expanded beam connector for detachable fiber arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 0757US2025306294A1On-Package Self-Aligning Expanded-Beam ConnectorINTEL CORP·Filed 2024·Application pending·0 cites
- 0856US2025306297A1Package with optical connectorINTEL CORP·Filed 2024·Application pending·0 cites
- 0956US2025306312A1Photonic integrated circuit packages including a barrier material to confine a thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 1056US2025306304A1Fiber array unit for high density optical fiber connections to photonic integrated circuit shorelinesINTEL CORP·Filed 2024·Application pending·0 cites
- 1156US2025362456A1Graded index (grin) lens expanded beam (eb) coupler for detachable fiber array unit (fau)INTEL CORP·Filed 2024·Application pending·0 cites
- 1256US2025306313A1Heat spreaders for optical fiber array interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1355US2025306307A1Sinterable nanoparticles for organic-free optical adhesivesINTEL CORP·Filed 2024·Application pending·0 cites
- 1455US2025306290A1Expanded beam optical coupling with a ball lensINTEL CORP·Filed 2024·Application pending·0 cites
- 1555US2025306318A1Expanded beam fiber array unit using spliced photonic crystal and mode field adapter fibersINTEL CORP·Filed 2024·Application pending·0 cites
- 1655US2025306287A1Tapered optical features for optical fiber connectionsINTEL CORP·Filed 2024·Application pending·0 cites
- 1754US2025306306A1Lid design, materials and process for passive fau alignment in co-package opticsINTEL CORP·Filed 2024·Application pending·0 cites
- 1854US2025102744A1Technologies for fiber array unit lid designsINTEL CORP·Filed 2023·Application pending·0 cites
- 1947US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 2045US11462527B2Micro-trenching mold interface in a pop packageINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·25 claims
- 2144US2022390694A1Thermal interface structures for optical communication devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 2240US2020273811A1Ic die package thermal spreader and emi shield comprising graphiteINTEL CORP·Filed 2019·Application pending·0 cites
- 2340US2020273768A1Crystalline carbon heat spreading materials for ic die hot spot reductionINTEL CORP·Filed 2019·Application pending·0 cites
- 2432US2017166407A1Universal pick and place head for handling components of any shapeINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →