Inventor · disambiguated record
Kuo-Hui Su
Also filed as: SU KUO-HUI
39 granted patents·33 pending applications·53 citations·filing 2003–2024
96Inventor score
Top patents by PatentIndex Score
72 records- 0194US11638375B2Method for preparing semiconductor memory device with air gaps for reducing capacitive couplingNANYA TECHNOLOGY CORP·Filed 2021·Granted Apr 25, 2023·4 cites·10 claims
- 0294US11444087B2Semiconductor memory device with air gaps for reducing capacitive coupling and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 13, 2022·6 cites·10 claims
- 0390US10651157B1Semiconductor device and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2019·Granted May 12, 2020·9 cites·20 claims
- 0486US11355342B2Semiconductor device with reduced critical dimensions and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Jun 7, 2022·4 cites·9 claims
- 0582US11309245B2Semiconductor device with metal spacers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Apr 19, 2022·3 cites·19 claims
- 0682US10937790B1Semiconductor device with air gap structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Mar 2, 2021·3 cites·10 claims
- 0778US8587131B1Through-silicon via and fabrication method thereofHUANG CHI-WEN·Filed 2012·Granted Nov 19, 2013·7 cites·6 claims
- 0877US10978459B2Semiconductor device with bit lines at different levels and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0977US2025374522A1Semiconductor structure having a memory structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1077US2025286026A1Semiconductor device with spacer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1177US2025374521A1Semiconductor structure having a memory structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1275US12218053B2Semiconductor device with metal spacers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Granted Feb 4, 2025·0 cites·10 claims
- 1374US12347680B2Method for preparing semiconductor device structure having features of different depthsNANYA TECHNOLOGY CORP·Filed 2024·Granted Jul 1, 2025·0 cites·11 claims
- 1474US2025246541A1Semiconductor device with liner structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1574US2025194075A1Memory device having improved p-n junction and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1674US2025246542A1Semiconductor device with liner structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1774US2025246540A1Semiconductor device with liner structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1874US2025286024A1Semiconductor device with spacer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1974US2025194167A1Memory device having improved p-n junction and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2074US2025286025A1Semiconductor device with spacer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2172US12256565B2Method for preparing recessed gate structure with protection layerNANYA TECHNOLOGY CORP·Filed 2024·Granted Mar 18, 2025·0 cites·16 claims
- 2272US2024363346A1Method for preparing semiconductor device structure having features of different depthsNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2371US2025323093A1Method of manufacturing semiconductor structure and semiconductor structure thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2471US2025323094A1Method of manufacturing semiconductor structure and semiconductor structure thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2569US2025140675A1Semiconductor device with slanted conductive layers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2669US2025192056A1Semiconductor device with filling layer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2769US2025192055A1Semiconductor device with filling layer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2868US7375017B2Method for fabricating semiconductor device having stacked-gate structureNANYA TECHNOLOGY CORP·Filed 2006·Granted May 20, 2008·3 cites·9 claims
- 2968US2025140672A1Semiconductor device with slanted conductive layers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 3066US11756885B2Method for fabricating semiconductor device with metal spacersNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 12, 2023·0 cites·18 claims
- 3165US11935850B2Method for fabricating semiconductor device with slanted conductive layersNANYA TECHNOLOGY CORP·Filed 2021·Granted Mar 19, 2024·0 cites·18 claims
- 3265US11776912B2Method for preparing semiconductor device structure with manganese-containing lining layerNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 3, 2023·0 cites·13 claims
- 3365US8536056B2Method of forming conductive patternSU KUO-HUI·Filed 2011·Granted Sep 17, 2013·2 cites·9 claims
- 3464US12154788B2Method for preparing semiconductor device structure having features of different depthsNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 26, 2024·0 cites·11 claims
- 3564US12009212B2Semiconductor device with reduced critical dimensionsNANYA TECHNOLOGY CORP·Filed 2021·Granted Jun 11, 2024·0 cites·11 claims
- 3664US9647133B2Low contact resistance thin film transistorPHAM DUY VU·Filed 2014·Granted May 9, 2017·2 cites·28 claims
- 3764US8754531B2Through-silicon via with a non-continuous dielectric layerCHIU YU-SHAN·Filed 2012·Granted Jun 17, 2014·3 cites·9 claims
- 3863US12315725B2Method for preparing semiconductor device structure having features of different depthsNANYA TECHNOLOGY CORP·Filed 2022·Granted May 27, 2025·0 cites·13 claims
- 3963US12211905B2Method for preparing recessed gate structure with protection layerNANYA TECHNOLOGY CORP·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
- 4063US11469182B2Semiconductor device structure with manganese-containing lining layer and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Oct 11, 2022·0 cites·11 claims
- 4163US11398441B2Semiconductor device with slanted conductive layers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jul 26, 2022·0 cites·13 claims
- 4262US11417667B2Method for preparing semiconductor device with air gap structureNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 16, 2022·0 cites·7 claims
- 4362US8420477B2Method for fabricating a gate dielectric layer and for fabricating a gate structureSU KUO HUI·Filed 2011·Granted Apr 16, 2013·1 cites·19 claims
- 4460US12308290B2Method for preparing semiconductor device structure with fluorine-catching layerNANYA TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·0 cites·15 claims
- 4557US2025125191A1Semiconductor device structure with reduced critical dimension and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 4656US12308319B2Semiconductor device structure with fluorine-catching layerNANYA TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·0 cites·14 claims
- 4756US11521926B2Semiconductor device structure with serpentine conductive feature and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 4854US9059142B2Semiconductor device having vertical gates and fabrication thereofLIANG WEN-PING·Filed 2012·Granted Jun 16, 2015·2 cites·14 claims
- 4951US2010276764A1Semiconductor structure with selectively deposited tungsten film and method for making the sameLO YI-JEN·Filed 2009·Application pending·0 cites
- 5049US12080773B2Recessed gate strcutre with protection layerNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 3, 2024·0 cites·14 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →