Inventor · disambiguated record
Kuo-Jui Tai
Also filed as: TAI KUO-JUI
0 granted patents·2 pending applications·0 citations·filing 2005–2013
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0141US2006160348A1Semiconductor element with under bump metallurgy structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
- 0239US2015048499A1Fine-pitch pillar bump layout structure on chipMACROTECH TECHNOLOGY INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →