Inventor · disambiguated record
Kuo-Shi Teng
Also filed as: TENG KUO-SHI
2 granted patents·17 citations·filing 1998–2000
57Inventor score
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0143US6660593B2Method for fabricating oxide layers with different thicknessesWINBOND ELECTRONICS CORP·Filed 2000·Granted Dec 9, 2003·3 cites·6 claims
- 0240US6034439AMethod and structure for preventing bonding pads from peeling caused by plug processWINBOND ELECTRONICS CORP·Filed 1998·Granted Mar 7, 2000·14 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →