Inventor · disambiguated record
Kun Teng
Also filed as: TENG KUN-TANG · Teng kun
4 granted patents·2 pending applications·179 citations·filing 1996–2022
75Inventor score
Top patents by PatentIndex Score
6 records- 0185US5710459AIntegrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliabilityIND TECH RES INST·Filed 1996·Granted Jan 20, 1998·127 cites·10 claims
- 0279US5839641AApparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devicesIND TECH RES INST·Filed 1997·Granted Nov 24, 1998·52 cites·11 claims
- 0359US12146008B2Modified chitosan, preparation method thereof, and additive for tile adhesive and use thereofSHANDONG ETON NEW MAT CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·9 claims
- 0455US2022348800A1Modified hydroxyethyl methyl cellulose for enhanced ceramic tile adhesive and preparation method and application thereofSHANDONG ETON NEW MAT CO LTD·Filed 2022·Application pending·0 cites
- 0551US2022348801A1Modified hydroxypropyl methyl cellulose for enhanced ceramic tile adhesive and preparation method and application thereofSHANDONG ETON NEW MAT CO LTD·Filed 2022·Application pending·0 cites
- 0645US11091565B2Preparation method of modified starch ether for improving anti-sliding property of ceramic tile adhesiveSHANDONG ETON NEW MAT CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →