Inventor · disambiguated record
Kuniharu Umeno
Also filed as: UMENO KUNIHARU
3 granted patents·1 pending application·24 citations·filing 2004–2011
64Inventor score
Top patents by PatentIndex Score
4 records- 0167US7023098B2Resin composition for encapsulating semiconductor chip and semiconductor device therewithSUMITOMO BAKELITE CO·Filed 2004·Granted Apr 4, 2006·18 cites·14 claims
- 0250US7291684B2Resin composition for encapsulating semiconductor chip and semiconductor device therewithSUMITOMO BAKELITE CO·Filed 2004·Granted Nov 6, 2007·6 cites·8 claims
- 0342US8709587B2Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor deviceUMENO KUNIHARU·Filed 2009·Granted Apr 29, 2014·0 cites·19 claims
- 0437US2011180208A1Method for laminating prepreg, method for producing printed wiring board and prepreg rollTACHIBANA KENYA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →