Inventor · disambiguated record

Kuo-Chien Wang

Also filed as: WANG KUO-CHIEN

2 granted patents·0 citations·filing 2019–2021

27Inventor score

Technology areasH10W

Files withWESTERN DIGITAL TECH INC2

Top patents by PatentIndex Score

2 records

0162US12051660B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
0254US11189582B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2019·Granted Nov 30, 2021·0 cites·11 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →