Inventor · disambiguated record
Kuo-Hsiu Wei
Also filed as: WEI KUO-HSIU
22 granted patents·5 pending applications·65 citations·filing 2002–2023
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15TAIWAN SEMICONDUCTOR MFG5KUO CHUN-TING3CHEN KEI-WEI1CHEN YUAN HSUAN1
Top patents by PatentIndex Score
27 records- 0188US9064770B2Methods for minimizing edge peeling in the manufacturing of BSI chipsKUO CHUN-TING·Filed 2012·Granted Jun 23, 2015·10 cites·22 claims
- 0286US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 0385US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 0484US11482450B2Methods of forming an abrasive slurry and methods for chemical- mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0583US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0680US9570311B2Modular grinding apparatuses and methods for wafer thinningKUO CHUN-TING·Filed 2012·Granted Feb 14, 2017·5 cites·20 claims
- 0778US6828226B1Removal of SiON residue after CMPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 7, 2004·24 cites·28 claims
- 0877US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0977US9676114B2Wafer edge trim blade with slotsKUO CHUN-TING·Filed 2012·Granted Jun 13, 2017·5 cites·19 claims
- 1074US10937691B2Methods of forming an abrasive slurry and methods for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 1174US9339912B2Wafer polishing tool using abrasive tapeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·2 cites·20 claims
- 1274US2023360919A1Wafer thinning method having feedback controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1373US9931726B2Wafer edge trimming tool using abrasive tapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 3, 2018·2 cites·20 claims
- 1472US10643853B2Wafer thinning apparatus having feedback control and method of usingCHEN YUAN HSUAN·Filed 2012·Granted May 5, 2020·3 cites·20 claims
- 1567US11728172B2Wafer thinning apparatus having feedback controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 1667US11532514B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1762US9566683B2Method for wafer grindingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
- 1858US10957587B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 1957US6769959B2Method and system for slurry usage reduction in chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 3, 2004·7 cites·20 claims
- 2052US2018337113A1Semiconductor Device with Multi Level Interconnects and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
- 2149US9829806B2Lithography tool with backside polisherTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·0 cites·21 claims
- 2248US2014209984A1Semiconductor Device With Multi Level Interconnects And Method Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Application pending·0 cites
- 2347US8049213B2Feature dimension measurementTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·0 cites·9 claims
- 2446US9120194B2Apparatus for wafer grindingWEI KUO-HSIU·Filed 2011·Granted Sep 1, 2015·0 cites·20 claims
- 2538US2004147116A1Novel method to reduce stress for copper CMPTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
- 2636US9721984B2Image sensor manufacturing methodsCHENG MU-HAN·Filed 2012·Granted Aug 1, 2017·0 cites·20 claims
- 2735US2012264303A1Chemical mechanical polishing slurry, system and methodCHEN KEI-WEI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →