Inventor · disambiguated record
Kuo-Yu Wu
Also filed as: WU KUO-YU
16 granted patents·3 pending applications·156 citations·filing 2003–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8VIA TECH INC4C ONE TECHNOLOGY CORP2TAIWAN SEMICONDUCTOR MFG2LAI YI-LIN1
Top patents by PatentIndex Score
19 records- 0192USD517559SMixed interface integrated circuit cardC ONE TECHNOLOGY CORP·Filed 2004·Granted Mar 21, 2006·67 cites·1 claims
- 0290US9128384B2Method of forming a patternTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 8, 2015·9 cites·16 claims
- 0388US12349493B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 1, 2025·2 cites·20 claims
- 0488US8892912B2Adaptive USB charging method and systemLAI YI-LIN·Filed 2011·Granted Nov 18, 2014·16 cites·24 claims
- 0588USD518483SMixed interface integrated circuit cardC ONE TECHNOLOGY CORP·Filed 2004·Granted Apr 4, 2006·45 cites·1 claims
- 0682US11848339B2Semiconductor structure including isolation structure and method for forming isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·1 cites·20 claims
- 0779US9373552B2Method of calibrating or exposing a lithography toolTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 0878US2025318302A1Transparent refraction structure for an image sensor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0976US9274577B2Adaptive USB charging method and systemVIA TECH INC·Filed 2014·Granted Mar 1, 2016·4 cites·23 claims
- 1075US9817788B2Hub devices and methods for initializing hub deviceVIA TECH INC·Filed 2016·Granted Nov 14, 2017·2 cites·13 claims
- 1173US12376402B2Transparent refraction structure for an image sensor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1272US11894404B2Method for fabricating an image sensing device having a primary grid and a second grid surrounding the primary gridTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 1372US2025287714A1Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1464US11348958B2Image sensing device with grid structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 1552US11749700B2Transparent refraction structure for an image sensor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1652US6790032B1Straight path carbon powder combustion machineFiled 2003·Granted Sep 14, 2004·7 cites·1 claims
- 1750US2014019658A1Hub devices and methods for initializing hub deviceVIA TECH INC·Filed 2013·Application pending·0 cites
- 1847US9257463B2Self-aligned implantation process for forming junction isolation regionsTSENG CHIEN-HSIEN·Filed 2012·Granted Feb 9, 2016·1 cites·20 claims
- 1946US10209756B2Operating system and control method thereofVIA TECH INC·Filed 2016·Granted Feb 19, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →