Inventor · disambiguated record
Kuo-Chung Yee
Also filed as: YEE KUO C · YEE KUO-CHUNG
193 granted patents·52 pending applications·1,486 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD200ADVANCED SEMICONDUCTOR ENG22TAIWAN SEMICONDUCTOR MFG10YEE KUO-CHUNG4PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC3
Top patents by PatentIndex Score
245 records- 0199US11581281B2Packaged semiconductor device and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·10 cites·20 claims
- 0299US10340249B1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·57 cites·20 claims
- 0399US10290611B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·50 cites·20 claims
- 0499US10056351B2Fan-out stacked system in package (SIP) and the methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·68 cites·20 claims
- 0599US10032722B2Semiconductor package structure having am antenna pattern and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·45 cites·9 claims
- 0699US9773757B2Devices, packaged semiconductor devices, and semiconductor device packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·86 cites·20 claims
- 0799US9768145B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·47 cites·20 claims
- 0898US11380645B2Semiconductor structure comprising at least one system-on-integrated-circuit componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·7 cites·20 claims
- 0998US11355418B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·5 cites·20 claims
- 1098US11342309B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 1198US11004799B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·4 cites·20 claims
- 1298US10157864B1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·19 cites·17 claims
- 1398US10128213B2Integrated fan-out stacked package with fan-out redistribution layer (RDL)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 13, 2018·16 cites·20 claims
- 1498US9966360B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·37 cites·20 claims
- 1598US9653442B2Integrated circuit package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·40 cites·20 claims
- 1698US9601463B2Fan-out stacked system in package (SIP) and the methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·44 cites·20 claims
- 1798US9373527B2Chip on package structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·46 cites·20 claims
- 1897US12347785B2Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 1, 2025·4 cites·20 claims
- 1997US10325879B2Fan-out stacked system in package (SIP) and the methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·13 cites·20 claims
- 2097US10049953B2Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·15 cites·20 claims
- 2197US9917072B2Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·15 cites·20 claims
- 2297US9136293B2Methods and apparatus for sensor moduleYEE KUO-CHUNG·Filed 2012·Granted Sep 15, 2015·45 cites·20 claims
- 2396US11854936B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·2 cites·20 claims
- 2496US11195816B2Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·11 cites·12 claims
- 2596US11171076B2Compute-in-memory packages and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·14 cites·21 claims
- 2696US10804242B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 13, 2020·9 cites·20 claims
- 2796US10461034B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·12 cites·20 claims
- 2896US10283473B1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·16 cites·20 claims
- 2996US8252629B2Method for making a stackable packageYEE KUO-CHUNG·Filed 2010·Granted Aug 28, 2012·30 cites·20 claims
- 3095US11289424B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·11 cites·20 claims
- 3195US11075145B2Semiconductor device including through die via and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·8 cites·20 claims
- 3295US10475747B2Integrated fan-out package and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·13 cites·20 claims
- 3395US9496196B2Packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·21 cites·20 claims
- 3495US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 3594US11658044B2Thermally conductive structure for heat dissipation in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 3694US11031344B2Package having redistribution layer structure with protective layer and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·7 cites·20 claims
- 3794US10269674B2Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 3894US10074615B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·10 cites·20 claims
- 3994US9969614B2MEMS packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 15, 2018·6 cites·20 claims
- 4094US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 4194US7371602B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 13, 2008·29 cites·12 claims
- 4294US7285434B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 23, 2007·29 cites·18 claims
- 4393US10879220B2Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·10 cites·20 claims
- 4493US9293437B2Functional block stacked 3DIC and method of making sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·13 cites·20 claims
- 4593US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 4692US12293991B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 4792US12199065B2Multi-die package structures including redistribution layersPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2020·Granted Jan 14, 2025·2 cites·19 claims
- 4892US11855020B2Chiplets 3D SoIC system integration and fabrication methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 4992US10971462B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 6, 2021·2 cites·20 claims
- 5092US9899443B2Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image bufferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·9 cites·20 claims
Showing the top 50 of 245 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →