Inventor · disambiguated record
Kung-Chen Yeh
Also filed as: YEH KUNG-CHEN
19 granted patents·4 pending applications·61 citations·filing 2011–2025
93Inventor score
Top patents by PatentIndex Score
23 records- 0196US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 0295US9793187B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·15 cites·20 claims
- 0394US11508692B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·3 cites·20 claims
- 0493US12119324B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 15, 2024·1 cites·20 claims
- 0593US11164824B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·3 cites·20 claims
- 0692US11948896B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·1 cites·20 claims
- 0789US8501590B2Apparatus and methods for dicing interposer assemblyWANG CHUNG YU·Filed 2011·Granted Aug 6, 2013·8 cites·16 claims
- 0888US9337063B2Package for three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·8 cites·18 claims
- 0987US10923438B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·3 cites·20 claims
- 1085US11476205B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 18, 2022·1 cites·20 claims
- 1184US11515267B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 1281US2024203906A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1379US2024371821A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1478US11990429B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1577US2025343088A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1675US12381177B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1774US8772929B2Package for three dimensional integrated circuitCHEN CHIH-HAO·Filed 2011·Granted Jul 8, 2014·3 cites·14 claims
- 1866US10269731B2Apparatus for dicing interposer assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·1 cites·20 claims
- 1964US9111912B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 18, 2015·1 cites·20 claims
- 2055US8946893B2Apparatus for dicing interposer assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·0 cites·20 claims
- 2154US2024234210A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2249US10872871B2Chip package structure with dummy bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 2343US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →