Inventor · disambiguated record
Kundae Yeom
Also filed as: YEOM KUNDAE
2 granted patents·6 pending applications·8 citations·filing 2013–2024
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0176US10008488B2Semiconductor module adapted to be inserted into connector of external deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·3 cites·19 claims
- 0265US9024426B2Semiconductor device and method of manufacturing the sameYEOM KUNDAE·Filed 2013·Granted May 5, 2015·5 cites·18 claims
- 0360US2025218800A1Semiconductor device, semiconductor package, and printed circuit board having a patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025336827A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0557US2025014963A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0654US2025379180A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2025239554A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0841US2022093673A1Image sensor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →