Inventor · disambiguated record
Kunio Yube
Also filed as: YUBE KUNIO
7 granted patents·3 pending applications·3 citations·filing 2005–2016
72Inventor score
Files withMITSUBISHI GAS CHEMICAL CO6TAMAI SATOSHI2FUJIFILM CORP1INC MITSUBISHI GAS CHEMICAL COMPANY1
Top patents by PatentIndex Score
10 records- 0159US9217106B2Etchant and etching process for oxides containing at least indium and galliumMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Dec 22, 2015·1 cites·16 claims
- 0257US9580818B2Etching liquid for film of multilayer structure containing copper layer and molybdenum layerTAMAI SATOSHI·Filed 2011·Granted Feb 28, 2017·1 cites·17 claims
- 0356US10023797B2Liquid composition for etching oxides comprising indium, zinc, tin, and oxygen and etching methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jul 17, 2018·1 cites·9 claims
- 0452US2014014615A1Etching liquid composition for multilayer containing copper and molybdenum and process for etching thereofINC MITSUBISHI GAS CHEMICAL COMPANY·Filed 2013·Application pending·0 cites
- 0549US2016186057A1Etching liquid composition for multilayer containing copper and molybdenum and process for etching thereofMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
- 0648US9365934B2Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrateMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Jun 14, 2016·0 cites·15 claims
- 0747US9466508B2Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Oct 11, 2016·0 cites·16 claims
- 0845US9824899B2Etching liquid for oxide containing zinc and tin, and etching methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 21, 2017·0 cites·11 claims
- 0938US9644274B2Etching solution for copper or a compound comprised mainly of copperTAMAI SATOSHI·Filed 2012·Granted May 9, 2017·0 cites·11 claims
- 1038US2009034362A1Microdevice and method for joining fluidsFUJIFILM CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →