Inventor · disambiguated record
Kwanyeob Chae
Also filed as: CHAE KWANYEOB
8 granted patents·10 pending applications·21 citations·filing 2016–2025
82Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
Top patents by PatentIndex Score
18 records- 0188US10115706B2Semiconductor chip including a plurality of padsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 30, 2018·7 cites·20 claims
- 0284US12451871B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·2 cites·16 claims
- 0382US11200928B2Memory controller and operating method with read margin control circuit determining data valid windowSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 14, 2021·2 cites·20 claims
- 0481US10073619B2Interface circuits configured to interface with multi-rank memorySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 11, 2018·4 cites·20 claims
- 0577US10650871B2Read margin control circuit determining data valid window, memory controller including the same, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·2 cites·20 claims
- 0674US9857973B1Interface circuits configured to interface with multi-rank memorySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 2, 2018·4 cites·20 claims
- 0762US2025265497A1Semiconductor device and training method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0857US2024332253A1System on chip including input and output circuit and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0956US2025266375A13d integrated circuit including protection circuitSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US2025265205A1Logic die and semiconductor device including logic dieSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1152US2025265210A1Memory controller communicating with vertically stacked dies and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1252US2025264529A1Logic die, semiconductor device including the same, and method of feedback testing of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1351US10756059B2Semiconductor chip including a plurality of padsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
- 1448US2025293693A1Semiconductor device and semiconductor system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1546US2025266080A1Integrated circuit reading data and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1645US2025329615A1Logic die for performing through silicon via repair operation and semiconductor device including the logic dieSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1744US2025266067A1Memory controller communicating with vertically stacked dies and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1828US10586575B2Interface circuit for multi rank memorySAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →